Title:
METHOD FOR MANUFACTURING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/138335
Kind Code:
A1
Abstract:
[Problem] Provided is a method for manufacturing a laminate using a hot-melt curable silicone composition, the method being adapted to liquid discharge by a dispenser, excelling in reaction controllability with suppressed curing reactivity at the dispense temperature, and enabling high-speed curing of the curable silicone composition after the discharge. [Solution] The method for manufacturing a laminate comprises a step of discharging a curable silicone composition that is filled in a dispenser cartridge, has a hot melt property as a whole and a melt viscosity at 100°C (measured by a flow tester) of 50 Pa·s or less and is curable by irradiation with high-energy rays onto a part or all of the surface of at least one substrate, and optionally, a step of curing the composition by irradiation with high-energy rays.
Inventors:
YAMAMOTO SHINICHI (JP)
YAMAZAKI RYOSUKE (JP)
YAMAZAKI RYOSUKE (JP)
Application Number:
PCT/JP2021/046092
Publication Date:
June 30, 2022
Filing Date:
December 14, 2021
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
B05D1/26; B05D7/24; B32B27/00; C08L83/05; C08L83/07; H01L23/29; H01L23/31; H05K3/28
Domestic Patent References:
| WO2018084012A1 | 2018-05-11 | |||
| WO2020090797A1 | 2020-05-07 | |||
| WO2020166692A1 | 2020-08-20 | |||
| WO2019088067A1 | 2019-05-09 | |||
| WO2017068762A1 | 2017-04-27 | |||
| WO2016136243A1 | 2016-09-01 |
Foreign References:
| JP2006188593A | 2006-07-20 | |||
| JP2014009322A | 2014-01-20 | |||
| JP2017512224W | ||||
| JP2020012027W | 2020-03-18 | |||
| JPS528854B2 | 1977-03-11 | |||
| JPH10195085A | 1998-07-28 |
Other References:
"DOWSILTM EA-4600 Silicone Adhesive Application Guide for PCB Device Assemblies", 2020, DOW TORAY CO., LTD.
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