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Title:
CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID
Document Type and Number:
WIPO Patent Application WO/2023/032545
Kind Code:
A1
Abstract:
Provided are: a cured product production method by which a cured product having excellent elongation at break is obtained; a laminate production method including said cured product production method; and a semiconductor device manufacturing method including said cured product production method or said laminate production method. Moreover, provided is a processing liquid used in said cured product production method.　This cured product production method comprises: a film forming step for applying a resin composition containing a precursor of a cyclized resin onto a substrate to form a film; a processing step for bringing a processing liquid into contact with the film; and a heating step for heating the film after the processing step, wherein the processing liquid contains at least one compound selected from the group consisting of an amide group-containing basic compound and an amide group-containing base generator.

Inventors:
NOZAKI ATSUYASU (JP)
TAKASHIMA MISAKI (JP)
SATO NAOKI (JP)
NAKAMURA ATSUSHI (JP)
Application Number:
PCT/JP2022/029287
Publication Date:
March 09, 2023
Filing Date:
July 29, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/312; C08G73/10; G03F7/027; G03F7/20; G03F7/32; G03F7/40
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Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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