Title:
CUT SURFACE SMOOTHING APPARATUS, PRODUCTION SYSTEM, CUTTING APPARATUS, AND TREATING METHOD FOR THREE-DIMENSIONAL FILAMENT BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/219963
Kind Code:
A1
Abstract:
Provided is a cut surface smoothing apparatus that can smoothen a cut surface of a three-dimensional filament bonded body. This cut surface smoothing apparatus has a high-temperature part which is heated to a temperature equal to or higher than the melting point of a three-dimensional filament bonded body, and smoothens a cut surface of the three-dimensional filament bonded body through abutting of the high-temperature part against the cut surface.
Inventors:
MIZUNO AKIRA (JP)
Application Number:
PCT/JP2022/009385
Publication Date:
October 20, 2022
Filing Date:
March 04, 2022
Export Citation:
Assignee:
AIRWEAVE INC (JP)
International Classes:
D06C25/00; D04H13/00; D06C7/00; D06H7/00
Domestic Patent References:
| WO2017122370A1 | 2017-07-20 |
Foreign References:
| JP2017057550A | 2017-03-23 | |||
| JP2011252241A | 2011-12-15 | |||
| JPH07299269A | 1995-11-14 | |||
| JPS63281606A | 1988-11-18 | |||
| CN212560895U | 2021-02-19 |
Attorney, Agent or Firm:
YAMAMOTO Hideo (JP)
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