Title:
CUTTING DEVICE AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/209160
Kind Code:
A1
Abstract:
A cutting device 1 cuts a connection body 4 of an electrode plate 2 having: a current collector plate 12 that has a first surface 12a and a second surface 12b facing away from each other; a first active material layer 14 that is laminated on the first surface 12a; and a second active material layer 16 that is laminated on the second surface 12b. The cutting device 1 comprises: a processing part 8 that cuts the first active material layer 14 and the current collector plate 12 by advancing a cutting blade 26 from the first active material layer 14 side, past the current collector plate 12, to a depth shallower than the surface of the connection body 4 on the second active material layer 16 side thereof; and a support part 10 that faces the processing part 8 with the connection body 4 interposed therebetween, supports the connection body 4, has a groove 30 at a position facing the cutting blade 26 and recessing in a direction away from the processing part 8, and enables removal of a section of the second active material layer 16 overlapping with the groove 30.
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Inventors:
ABE RYUTA
MASADA TATSUYA
MARUYAMA MASAHIDE
MASADA TATSUYA
MARUYAMA MASAHIDE
Application Number:
PCT/JP2022/001545
Publication Date:
October 06, 2022
Filing Date:
January 18, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B26D1/40; B26D7/20; H01G11/86; H01G13/00; H01M4/04; H01M4/139
Foreign References:
| JP2020524081A | 2020-08-13 | |||
| JP2017033667A | 2017-02-09 | |||
| JP2017041352A | 2017-02-23 | |||
| JP2019046677A | 2019-03-22 | |||
| JP2016219330A | 2016-12-22 |
Attorney, Agent or Firm:
MUNETA Satoshi (JP)
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