Title:
CUTTING PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/243234
Kind Code:
A1
Abstract:
Provided is a cutting processing system with which it is possible suitably set cutting processing information in a processing device so as to reduce the amount of electric power consumed, and to effectively cut the amount of CO2 discharged. A cutting processing system that sets cutting processing information in a processing device, wherein: on the basis of at least cut material information, tool information, and processing condition information that are inputted after construction of a database in which an amount of electric power consumed, the cut material information, the tool information, and the processing condition information are associated so as to be linked (S13), the amount of electric power consumed is extracted from the database (S14); the tool information, the processing condition information, and the amount of electric power consumed that are registered in the database are extracted on the basis of material information pertaining to a cut material, and a candidate amount of electric power consumed is calculated using processing shape information pertaining to the cut material (S15); and the amount of electric power consumed that is extracted from the database, the calculated candidate amount of electric power consumed, the tool information that is associated with these amounts, and the processing condition information are displayed (S16, S17).
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Inventors:
FUKUOKA NOBUHIKO (JP)
NISHIKAWA KENJI (JP)
NISHIKAWA KENJI (JP)
Application Number:
PCT/JP2023/016580
Publication Date:
December 21, 2023
Filing Date:
April 27, 2023
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
B23Q17/00; G05B19/418
Domestic Patent References:
| WO2012104925A1 | 2012-08-09 |
Foreign References:
| JP2011138463A | 2011-07-14 | |||
| JP2009012092A | 2009-01-22 | |||
| US20160132033A1 | 2016-05-12 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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