Title:
CUTTING SYSTEM, DISPLAY SYSTEM, PROCESSING DEVICE, PROCESSING METHOD, AND PROCESSING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/210037
Kind Code:
A1
Abstract:
The present invention achieves exceptional functionality pertaining to cutting blades in a cutting tool. A cutting system comprises a cutting tool for milling machining, a plurality of sensors, and a processing unit. The cutting tool performs cutting machining in which two or more cutting blades are used. The plurality of sensors measure physical quantities that indicate a state pertaining to a load of the cutting tool during cutting machining. The processing unit generates, on the basis of measurement results from the sensors at a plurality of measurement timings, two-dimensional data for each of the measurement timings, the two-dimensional data pertaining to the load in two directions within a plane perpendicular to the axis of rotation of the cutting tool. The processing unit moreover sorts the generated two-dimensional data into one of a plurality of unit regions, the number of which is equal to or greater than the number of cutting blades, in the plane, and senses an abnormality in the cutting blades on the basis of the two-dimensional data for each of the unit regions.
Inventors:
KOIKE YUSUKE (JP)
Application Number:
PCT/JP2020/016248
Publication Date:
October 21, 2021
Filing Date:
April 13, 2020
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B23C9/00; B23Q17/09
Foreign References:
| JP2020011330A | 2020-01-23 | |||
| JPH068106A | 1994-01-18 | |||
| JPS6362645A | 1988-03-18 | |||
| CN109940459A | 2019-06-28 | |||
| JPH031744U | 1991-01-09 | |||
| JP2015077658A | 2015-04-23 | |||
| JP2013132734A | 2013-07-08 | |||
| JP2018043317A | 2018-03-22 | |||
| JP2018024086A | 2018-02-15 | |||
| JP2006071485A | 2006-03-16 | |||
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| JP2016040071A | 2016-03-24 | |||
| US20150261207A1 | 2015-09-17 | |||
| EP3486737A1 | 2019-05-22 |
Other References:
See also references of EP 4137258A4
Attorney, Agent or Firm:
ONEDEE IP PARTNERS (JP)
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