Title:
CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2023/148973
Kind Code:
A1
Abstract:
A cutting tool comprising a base material and a coating film disposed on the base material, wherein the coating film includes a titanium compound layer disposed on the base material and an α-Al2O3 layer disposed directly above the titanium compound layer, the α-Al2O3 layer is formed of a plurality of α-Al2O3 particles, the α-Al2O3 layer includes a region A1 and a region A2, the region A1 is a region interposed between a virtual surface SA2 located 0.5 μm apart, toward the surface side of the coating film, from an interface P1 formed by the titanium compound layer and the α-Al2O3 layer, and a virtual surface SA3 located 1.0 μm apart from the interface P1 toward the surface side of the coating film, the region A2 is a region interposed between the interface P1 and a virtual surface SA1 located 0.3 μm apart from the interface P1 toward the surface side of the coating film, the titanium compound layer is formed of a plurality of titanium compound particles, the titanium compound particles are of at least one type selected from the group consisting of TiCN particles, TiCNO particles, TiAlCN particles, and TiAlCNO particles, the titanium compound layer includes a region B1 and a region B2, the region B1 is a region interposed between a virtual surface SB2 located 0.5 μm apart from the interface P1 toward the base material side and a virtual surface SB3 located 1.0 μm apart from the interface P1 toward the base material side, the region B2 is a region interposed between the interface P1 and a virtual surface SB1 located 0.3 μm apart from the interface P1 toward the base material side, the average particle size a1 of the α-Al2O3 particles in the region A1, the average particle size a2 of the α-Al2O3 particles in the region A2, the average particle size b1 of the titanium compound particles in the region B1, and the average particle size b2 of the titanium compound particles in the region B2 satisfy the relationships indicated by formula 1: 0.80≤a2/b2≤1.27, formula 2: 1.50≤a1/a2≤10, and formula 3: 1.45≤b1/b2≤5, and the average particle size b1 is 0.10-0.50 μm.
Inventors:
HIKIJI MASAHITO (JP)
OKUNO SUSUMU (JP)
YAMANISHI TAKATO (JP)
OKUNO SUSUMU (JP)
YAMANISHI TAKATO (JP)
Application Number:
PCT/JP2022/004701
Publication Date:
August 10, 2023
Filing Date:
February 07, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
International Classes:
B23B27/14; C23C16/30; C23C16/36; C23C16/40
Foreign References:
| JP2019025615A | 2019-02-21 | |||
| JP6210348B1 | 2017-10-11 | |||
| JP5872748B1 | 2016-03-01 | |||
| JP2012096303A | 2012-05-24 |
Other References:
See also references of EP 4299218A4
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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