Title:
CYANIDE ELECTROLYTIC GOLD PLATING BATH AND BUMP FORMATION METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/190218
Kind Code:
A1
Abstract:
The present invention provides a cyanide electrolytic gold plating bath that: comprises gold cyanide as a gold source at a gold concentration of 0.1 - 15 g/L, an oxalate at 2.5 - 50 g/L of oxalic acid, 5 - 100 g/L of an inorganic acid conducting salt, 0.1 - 50 g/L of water soluble sugars, and a crystal modifier at a metal concentration of 0.1 - 100 mg/L; and is able to form gold bumps for which the film hardness after heat treatment is 70 - 120 HV.
Inventors:
FURUKAWA MASATO (JP)
Application Number:
PCT/JP2015/063991
Publication Date:
December 17, 2015
Filing Date:
May 15, 2015
Export Citation:
Assignee:
METALOR TECHNOLOGIES JAPAN CORP (JP)
International Classes:
C25D3/48; C25D5/50; H01L21/60
Foreign References:
| JPS471956A | ||||
| JPS5684495A | 1981-07-09 | |||
| JPH0959792A | 1997-03-04 | |||
| JP2004360006A | 2004-12-24 |
Attorney, Agent or Firm:
KIMURA YOSHIHIRO (JP)
Yoshihiro Kimura (JP)
Yoshihiro Kimura (JP)
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