Title:
DAMAGING PROCESS DEVICE AND METHOD FOR CLEAVAGE SITE USED FOR CUTTING MEDICAL GLASS PRODUCT
Document Type and Number:
WIPO Patent Application WO/2020/130022
Kind Code:
A1
Abstract:
The damaging process device for a cleavage site of a medical glass product according to one embodiment of the present invention may comprise: a laser light source for emitting a burst of an ultrafast laser beam; a beam profile formation unit for shaping the ultrafast laser beam so as to have a plurality of focal lengths and an elongated profile configuration; a beam irradiation unit which causes an inner damage to be formed due to a bulk deformation-induced internal flaw inside glass of the medical glass product by performing irradiation with the ultrafast laser beam so as to cause the profile of the shaped ultrafast laser beam to be formed inside the glass of the medical glass product; and a rotary unit which spins the medical glass product at a prescribed rotation speed. Consequently, the present invention is able to provide a processing method for a medical glass product which minimizes particle generation when being cut.
Inventors:
KANG HYOUNG SHIK (KR)
MIYAMOTO KIMIO (JP)
SANO KAZUHIKO (JP)
MIYAMOTO KIMIO (JP)
SANO KAZUHIKO (JP)
Application Number:
PCT/JP2019/049560
Publication Date:
June 25, 2020
Filing Date:
December 18, 2019
Export Citation:
Assignee:
NIPRO CORP (JP)
International Classes:
C03C23/00; C03B33/095
Domestic Patent References:
| WO2017038869A1 | 2017-03-09 |
Foreign References:
| US20150140241A1 | 2015-05-21 | |||
| JPS63222765A | 1988-09-16 | |||
| JP2018002501A | 2018-01-11 | |||
| JPH1171124A | 1999-03-16 |
Other References:
See also references of EP 3882225A4
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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