DECONTAMINATION OF SUPERCRITICAL WAFER PROCESSING EQUIPMENT

Title:

DECONTAMINATION OF SUPERCRITICAL WAFER PROCESSING EQUIPMENT

Document Type and Number:

WIPO Patent Application WO2004104697

Kind Code:

A3

Abstract:

A method is disclosed for decontaminating a supercritical processing apparatus and/or wafers after a wafer (213) cleaning step. In accordance the embodiments of the invention, a supercritical cleaning step (501) utilizes a surfactant to clean a wafer (213) and uses a supercritical rinse solution in a post-cleaning step (505) to decontaminate the supercritical processing apparatus, the wafer or both from processing residues. In accordance with further embodiments of the invention, supercritical rinse solutions are used to cure processing surfaces of the supercritical processing apparatus after the supercritical processing apparatus is serviced or when replacement parts are installed.

Inventors:

SCHILLING PAUL E
HILLMAN JOSEPH

Application Number:

PCT/US2004/015370

Publication Date:

July 14, 2005

Filing Date:

May 13, 2004

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SUPERCRITICAL SYSTEMS INC (US)

International Classes:

B08B7/00; (IPC1-7): B08B3/00

Foreign References:

US6500605B1	2002-12-31
US6228826B1	2001-05-08
US6344243B1	2002-02-05

Download PDF:

View/Download PDF PDF Help

Previous Patent: INFORMATION RECORDING MEDIUM, METHOD OF RECORDING AND REGENERATION THEREWITH AND INFORMATION RECORDI...

Next Patent: DIELECTRIC MATERIALS TO PREVENT PHOTORESIST POISONING