DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD

WIPO Patent Application WO/2021/024319

A1

A defect inspection device (100) is provided with: an illumination unit (101) that applies a linear illumination spot to the upper surface of a sample (1); a condensing detection unit (102) that condenses reflected light of the illumination spot from the surface of the sample (1); and a sensor unit (103) that forms an optical image of the illumination spot by the condensing detection unit (102) on a light reception surface, and outputs the optical image as an electrical signal. An angle α formed between the optical axis of the condensing detection unit (102) and the longitudinal direction of the linear illumination spot applied to the sample (1) is not less than 10° but less than 80°. The sensor unit (103) is a line sensor provided with array-like light reception units at positions conjugate with the illumination spot. An angle β formed between the arraying direction of the line sensor and the optical axis of the condensing detection unit (102) is not less than 10° but less than 80°, and a difference from the angle α is 5° or more.

JPS6358582	PATTERN INSPECTING CIRCUIT
JP7410402	Visual inspection system
JP4988224	Defect inspection method and its equipment

HONDA TOSHIFUMI (JP)
URANO YUTA (JP)
MATSUMOTO SHUNICHI (JP)
KANAI HISAAKI (JP)

PCT/JP2019/030561

February 11, 2021

August 02, 2019

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HITACHI HIGH TECH CORP (JP)

G01N21/956

WO2013161912A1

2013-10-31

JP2007033433A	2007-02-08
JP2014534611A	2014-12-18
JP2009236791A	2009-10-15
JP2012021994A	2012-02-02
JPH08201306A	1996-08-09
US7525649B1	2009-04-28

ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)

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