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Patent Searching and Data


Title:
DEGREASING METHOD AND DEGREASED BODY AND SINTERED BODY OBTAINED BY THE METHOD
Document Type and Number:
WIPO Patent Application WO/1998/018586
Kind Code:
A1
Abstract:
A degreasing method by which the time required for a degreasing process using vaporization/evaporation by heat and thermal decomposition is significantly reduced while the shape of an injection-molded item is retained is provided at a low cost. The degreasing process includes a 1st step in which the injection-molded item is placed in a low-pressure atmosphere whose pressure is lower than the normal pressure, heated at a temperature lower than the melting point of thermoplastic binder to vaporize at least 5 wt.% of the whole thermoplastic binder, and heated at a temperature lower than the melting point of the higher melting point component among an organic compound component and a thermoplastic resin component which easily vaporize to vaporize at least 10 wt.% of the whole thermoplastic binder, and the final heating temperature is not higher than 200 �C, and a 2nd step in which the molded item is heated to a temperature not lower than the highest melting point of the thermoplastic binder components in the atmosphere of gas which is inactive to the selected powder material under a pressure not lower than the normal pressure.

Inventors:
TAKAYAMA TAKEMORI
OHYAMA YOSHITAKA
OKAMURA KAZUO
MIYAKE MASATO
SAITO KATSUYOSHI
ONO HIROSHI
Application Number:
PCT/JP1997/003891
Publication Date:
May 07, 1998
Filing Date:
October 23, 1997
Export Citation:
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Assignee:
KOMATSU MFG CO LTD (JP)
International Classes:
C04B35/638; B22F1/10; B22F3/10; (IPC1-7): B22F3/10; C04B35/64
Foreign References:
JPH0474769A1992-03-10
JPH0825802B21996-03-13
JPH07305101A1995-11-21
JPH07330444A1995-12-19
JPS609801A1985-01-18
Attorney, Agent or Firm:
Inoue, Tsutomu (4F 2-12, Itachibori 1-chome, Nishi-k, Osaka-shi Osaka 550, JP)
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