DEVICE, METHOD FOR MANUFACTURE OF DEVCE, AND METHOD FOR MANUFACTURE OF ARRAY-TYPE ULTRASOUND PROBE

WIPO Patent Application WO/2018/047585

A1

The purpose of the present invention is to provide an array-type ultrasound probe as a device in which a plurality of piezoelectric elements are arranged in an array shape at prescribed intervals and which possesses a structure so as to be manufactured with a desirable manufacturing yield. This ultrasound probe (AP) has a structure which comprises: a first dry film resist (22) which further comprises a plurality of first apertures (22a) which are installed in an array shape, and supports piezoelectric elements (21) in a partially exposed state with rim parts of the respective first apertures being in close contact therewith; a second dry film resist (23) which is layered upon the first dry film resist, has a thickness equivalent to the thickness of the piezoelectric elements, and further comprises second apertures (23a) which surround the respective function elements; and a third dry film resist (24) which is layered upon the second dry film resist, further comprises third apertures (24a), and sandwiches, against the first dry film resist, the respective piezoelectric elements in a partially exposed state with rim parts of the respective third apertures being in close contact therewith.

SUZUKI TAICHI (JP)
FUWA KOH (JP)
MAEHIRA KEN (JP)
OHASHI YASUTOMO (JP)
FUJITA KATSUHIRO (JP)
HAGA YOICHI (JP)
MATSUNAGA TADAO (JP)

PCT/JP2017/029364

March 15, 2018

August 15, 2017

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ULVAC INC (JP)
UNIV TOHOKU (JP)

A61B8/14; H04R17/00; H04R31/00

JPS6153562A	1986-03-17
JPS6086999A	1985-05-16
JPH05292598A	1993-11-05
JP2006094459A	2006-04-06

SEIGA PATENT AND TRADEMARK CORPORATION (JP)

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