Title:
DEVICE AND METHOD FOR SCRIBING SUBSTRATE OF BRITTLE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2004/002705
Kind Code:
A1
Abstract:
A method for scribing a substrate of a brittle material, comprising the step of moving a laser spot so as to become slower than a scribe line forming speed or be temporarily stopped at the end part of the substrate of the brittle material, whereby triggers (cutouts) can be formed without using a scribing cutter such as a cutter wheel and subsequently the substrate of the brittle material can be scribed.
Inventors:
OTODA KENJI (JP)
NISHIO YOSHITAKA (JP)
NISHIO YOSHITAKA (JP)
Application Number:
PCT/JP2003/008158
Publication Date:
January 08, 2004
Filing Date:
June 26, 2003
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
OTODA KENJI (JP)
NISHIO YOSHITAKA (JP)
OTODA KENJI (JP)
NISHIO YOSHITAKA (JP)
International Classes:
B23K26/06; B23K26/40; B28D1/22; B28D5/00; C03B33/03; C03B33/09; (IPC1-7): B28D5/00; B23K26/36; C03B33/02; C03B33/09
Foreign References:
| JP2002144067A | 2002-05-21 | |||
| JP2001130921A | 2001-05-15 | |||
| JPH11784A | 1999-01-06 | |||
| JP2002043605A | 2002-02-08 |
Attorney, Agent or Firm:
Yamamoto, Shusaku (Crystal Tower 2-27, Shiromi 1-chome,, Chuo-k, Osaka-shi Osaka, JP)
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