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Patent Searching and Data


Title:
DEVICE AND PREPARATION METHOD THEREFOR, RECEIVER CHIP, DISTANCE MEASURING DEVICE, AND MOVABLE PLATFORM
Document Type and Number:
WIPO Patent Application WO/2022/061821
Kind Code:
A1
Abstract:
The present application provides a semiconductor device and a preparation method therefor, a receiver chip, a distance measuring device, and a movable platform. The semiconductor device comprises: an epitaxial layer which comprises a first surface and a second surface that are oppositely arranged; several avalanche photodiodes which are formed on the first surface of the epitaxial layer, incident light entering the avalanche photodiodes through the second surface of the epitaxial layer; several first electrodes which are formed on the first surface of the epitaxial layer at intervals and completely cover the avalanche photodiodes corresponding to the first electrodes vertically; and a second electrode comprising a heavily doped region formed on the second surface of the epitaxial layer. The semiconductor device solves the trailing problem caused by substrate photon-generated carrier diffusion and substrate impurity diffusion, and can improve the shielding effect of photon-generated carriers and reduce delays, while the quantum efficiency remains unchanged.

Inventors:
WANG GUOCAI (CN)
LU DONG (CN)
ZHENG GUOGUANG (CN)
Application Number:
PCT/CN2020/118151
Publication Date:
March 31, 2022
Filing Date:
September 27, 2020
Export Citation:
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Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
H01L27/146; H01L31/107
Foreign References:
CN109524430A2019-03-26
CN105118886A2015-12-02
CN101350376A2009-01-21
CN109638092A2019-04-16
CN101950775A2011-01-19
US20100053594A12010-03-04
Attorney, Agent or Firm:
P. C. & ASSOCIATES (CN)
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