CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority from U.S. Provisional Patent Application No. 63/296,140, filed on January 3, 2022, which is incorporated by reference herein in its entirety.

BACKGROUND

[0002] Porous materials, including for example, building materials such as concrete, cement, cinder blocks, bricks, mortar, and the like, often retain and/or allow the passage of moisture therein and/or therethrough. Moisture may initially enter these materials through the exposure of the materials to water from French drains, leaking pipes, runoff, springs, and the like. Subterranean portions of structures, such as basements, are the typical sites of these moisture issues.

[0003] Moisture in these materials can lead to degradation of the material itself (such as weakened mortar between bricks and cinder blocks), potentially dangerous mold and mildew growth within the moist areas, and rust or other corrosion of metal objects contained in the moist areas. Rust of metal structural items, such as beams, posts, joists, ties, and the like can lead to potentially dangerous degradation of the structural integrity of the structure. Rust of metal items such as gas lines can lead to potentially dangerous gas leaks. And finally, high moisture within enclosed subterranean areas is simply uncomfortable and unpleasant to individuals working or living in these areas.

[0004] What is needed is a device for reduction of moisture in porous materials. SUMMARY

[0005] In one aspect, a device for reduction of moisture in porous materials is provided, the device comprising: an upper conductive board comprising: a first side and a second side, one or more conductive track arranged in a spiral on the first side, and one or more conductive track arranged in a spiral on the second side; a lower conductive board comprising: a first side, one or more conductive track arranged in a spiral on the first side; and a conductive coupler extending from a radially inner core of the first side of the lower conductive board to a radially inner core of the second side of the upper conductive board, wherein the conductive coupler includes a terminal connected to a switch, and wherein the switch prevents the flow of electricity through the conductive coupler and allows the flow of electricity through the conductive coupler.

[0006] In another aspect, a device for reduction of moisture in porous materials is provided, the device comprising: an upper conductive board comprising: a first side and a second side, three conductive tracks arranged in a spiral on the first side, and three conductive tracks arranged in a spiral on the second side; a lower conductive board comprising: a first side, three conductive tracks arranged in a spiral on the first side; and a conductive coupler extending from a radially inner core of the first side of the lower conductive board to a radially inner core of the second side of the upper conductive board, wherein the conductive coupler includes a terminal connected to a switch, and wherein the switch prevents the flow of electricity through the conductive coupler and allows the flow of electricity through the conductive coupler.

BRIEF DESCRIPTION OF THE FIGURES

[0007] The accompanying figures, which are incorporated in and constitute a part of the specification, illustrate various example systems and apparatuses, and are used merely to illustrate various example embodiments. In the figures, like elements bear like reference numerals.

[0008] FIG. 1A illustrates a top perspective view of a device 100 for reduction of moisture in porous materials.

[0009] FIG. IB illustrates a bottom perspective view of device 100 for reduction of moisture in porous materials.

[0010] FIG. 1C illustrates a top perspective view of device 100 with an upper case portion 102 and a lower case portion 104 separated to permit viewing of the conductive boards 108, 110 contained within device 100.

[0011] FIG. ID illustrates a top perspective view of device 100 with upper case portion 102 removed to permit viewing of conductive boards 108, 110 contained within device 100.

[0012] FIG. IE illustrates an exploded top perspective view of device 100 with upper case portion 102 removed to permit viewing of conductive boards 108, 110 contained within device 100

[0013] FIG. IF illustrates an exploded bottom perspective view of device 100 with upper case portion 102 removed to permit viewing of conductive boards 108, 110 contained within device 100.

[0014] FIG. 1G illustrates a sectional view of device 100 to permit viewing of conductive boards 108, 110 contained within device 100.

[0015] FIG. 1H illustrates a sectional view of device 100 to permit viewing of conductive boards 108, 110 contained within device 100. [0016] FIG. 2A illustrates an exploded top perspective view of a device 200 for reduction of moisture in porous materials.

[0017] FIG. 2B illustrates an exploded bottom perspective view of device 200.

[0018] FIG. 3A illustrates a sectional view of a device 300 for reduction of moisture in porous materials.

[0019] FIG. 3B illustrates a plan view of device 300.

[0020] FIG. 3C illustrates a plan view of device 300 with an upper case portion removed.

[0021] FIG. 4 illustrates a graph demonstrating internal wall moisture evolution within a building’s walls after the installation of a device for reduction of moisture in porous materials within the building.

DETAILED DESCRIPTION

[0022] FIG. 1A-1H illustrate a device 100 for reduction of moisture in porous materials. Device 100 may include an upper case portion 102 and a lower case portion 104.

[0023] Upper case portion 102 may include a lower edge 120. Lower case portion 104 may include an upper edge 122. Lower edge 120 and upper edge 122 may be configured to mate with one another to form a total enclosure around the interior contents of device 100. Lower case portion 104 may include a base 124 to which at least some of the interior contents of device 100 may be mounted. Upper case portion 102 and lower case portion 104 may be formed from any of a variety of materials, including for example a metal, a polymer, a composite, and the like. Upper case portion 102 and lower case portion 104 may be formed from aluminum. Upper case portion 102 and lower case portion 104 may be coated in an anti-static paint. [0024] Device 100 may include a fastening aperture 106 on base 124 to permit a user to mount device 100 to a ceiling, wall, post, floor, beam, or the like. Fastening aperture 106 may be a threaded boss fixed to base 124. Fastening aperture 106 may be a hole to permit passage of a bolt, screw, nail, or other fastener from within the interior of device 100.

[0025] Device 100 may include elements within upper case portion 102 and lower case portion 104. These elements may include an upper conductive board 108 and a lower conductive board 110. Upper conductive board 108 and lower conductive board 110 may be substantially parallel to one another. Upper conductive board 108 and lower conductive board 110 may be fixed to base 124 of lower case portion 104, and relative to one another, by one or more supporting element 118. Conductive board 108, 110 may be round, and one or more supporting element 118 may be oriented at or near the radially outer sides of conductive board 108, 110. One or more supporting element 118 may be made from any of a variety of materials, including for example a metal, a polymer, a composite, and the like. One or more supporting element 118 may be formed from an electrically non-conductive and/or insulative material such as a polymer.

[0026] Upper conductive board 108 may include one or more conductive track 112. Upper conductive board 108 may include a plurality of separate conductive tracks 112. Upper conductive board 108 may include one or more separate conductive tracks 112, 114 on a first (top) side and a second (bottom) side opposite to the first side. Upper conductive board 108 may include three conductive tracks 112A-112C on a first (top) side, and three conductive tracks 114A-114C on a second (bottom) side opposite to the first side. Upper conductive board 108 may include more than three conductive tracks 112, 114, including for example four, five, six, or more conductive tracks 112, 114. [0027] Conductive tracks 112A-112C may extend in a clockwise direction from a radially inner portion of board 108 to a radially outer portion of board 108 on the first (top) side. Conductive tracks 114A-114C may extend in a counterclockwise direction from a radially inner portion of board 108 to a radially outer portion of board 108 on the second (bottom) side. Conductive tracks 112A-112C and 114A-114C may extend in opposite directions from one another. Conductive tracks 112A-112C and 114A-114C may extend from a radially inner core portion of board 108 in a spiral shape with an increasing radius until its termination at or near a radially outer portion of board 108.

[0028] Upper board 108 may be a printed circuit board. Conductive tracks 112, 114 may be made from an electrically conductive material, including for example, a metal such as silver, gold, or copper.

[0029] Conductive tracks 112A-112C may be electrically connected to one another at a radially inner core portion of board 108. Conductive tracks 114A-114C may be electrically connected to one another at a radially inner core portion of board 108. Conductive tracks 112A- 112C may be electrically insulated from one another at a radially inner portion of board 108. Conductive tracks 114A-114C may be electrically insulated from one another at a radially inner portion of board 108.

[0030] Lower conductive board 110 may include one or more conductive track 116. Lower conductive board 110 may include a plurality of separate conductive tracks 116. Lower conductive board 110 may include one or more separate conductive tracks 116 on a first (top) side and a second (bottom) side opposite to the first side. Lower conductive board 110 may include three conductive tracks 116A-116C on a first (top) side, and no conductive tracks on a second (bottom) side opposite to the first side. [0031] Conductive tracks 116A-116C may extend in a clockwise direction from a radially inner portion of board 110 to a radially outer portion of board 110 on the first (top) side. Conductive tracks 116A-116C and 112A-112C may extend in the same direction as one another. Conductive tracks 116A-116C may extend in a direction opposite that of conductive tracks 114A-114C. Conductive tracks 116A-116C may extend from a radially inner core portion of board 110 in a spiral shape with an increasing radius until its termination at or near a radially outer portion of board 110.

[0032] Lower board 110 may be a printed circuit board. Conductive track 116 may be made from an electrically conductive material, including for example, a metal such as silver, gold, or copper.

[0033] Conductive tracks 116A-116C may be electrically connected to one another at a radially inner portion of board 110. Conductive tracks 116A-116C may be electrically insulated from one another at a radially inner portion of board 110.

[0034] Upper conductive board 108 and lower conductive board 110 may be connected by a conductive coupler 126. Conductive coupler 126 may be made from an electrically conductive material, including for example, a metal such as silver, gold, or copper. Conductive coupler 126 may extend from a radially inner core of a first (top) side of lower conductive board 110 to a radially inner core of a second (bottom) side of upper conductive board 108. The radially inner core of the second (bottom) side of upper conductive board 108 may be electrically connected to the radially inner core of the first (top) side of upper conductive board 108.

[0035] FIGS. 2A and 2B illustrate a device 200 for reduction of moisture in porous materials. Device 200 may include an upper case portion 102 and a lower case portion 104. [0036] An upper conductive board and a lower conductive board may be connected by a conductive coupler 126. Conductive coupler 126 may be made from an electrically conductive material, including for example, a metal such as silver, gold, or copper. Conductive coupler 126 may include a terminal 230 connected to a switch 234 via a wire 232, configured to selectively “break” or “open” conductive coupler 126 to prevent the flow of electricity or other energy through conductive coupler 126. Switch 234 may likewise selectively “close” conductive coupler 126 to allow the flow of electricity or other energy through conductive coupler 126. Switch 234 may be oriented on the exterior of one of upper case portion 102 or lower case portion 104 to permit a user to manipulate the flow of electricity or other energy through conductive coupler 126 from the outside of device 200 when device 200 is assembled and/or installed.

[0037] Device 200 may include one or more protective bumper 236 on one or both of upper case portion 102 and lower case portion 104. Bumpers 236 may be a rubber, polymer, metal, or the like, and designed to prevent damage (e.g., dents, cracks, scrapes, and scratches) to one or both of upper case portion 102 and lower case portion 104.

[0038] Device 200 may include a grounding element 238 connected to one or both of upper case portion 102 and lower case portion 104. Grounding element 238 may be connected to one or both of upper case portion 102 and lower case portion 104 via an electrically conductive stud 240. Grounding element 238 may be a wire or other conductor capable of carrying an electrical current to ground device 200.

[0039] Upper case portion 102, lower case portion 104, upper conductive board 108, and lower conductive board 110, in each of FIGS. 1A-1H and FIGS. 2A-2B are illustrated as being round/circular in shape. It is contemplated that any of these elements may have any of a variety of alternative shapes, including for example, square, hexagonal, and the like.

[0040] It is contemplated that in either of devices 100 or 200, a non-conductive liner could be placed upon the interior walls of one or both of upper case portion 102 and lower case portion 104. This liner may act as padding to prevent damage to internal components of devices 100 or 200 should those internal components become loose within upper case portion 102 and/or lower case portion 104.

EXAMPLE

[0041] FIG. 3A-3C illustrate a device 300 for reduction of moisture in porous materials. In one example arrangement, device 300’ s combined upper and lower case portions have a central diameter CD of about 323.85 mm. Device 300’s upper and lower case portions have base diameters BD (at their extreme upper and lower surfaces, respectively) of about 276.23 mm. Device 300’ s combined upper and lower case portions have a height H of about 165.10 mm.

[0042] Device 300’ s upper conduct board and lower conductive board are separated by a spacing S of about 50.80 mm. Device 300’ s upper conductive board includes an upper offset UO from the extreme upper surface of the upper case portion of about 50.80 mm. Device 300’ s lower conductive board includes a lower offset LO from the extreme lower surface of the lower case portion of about 50.80 mm.

[0043] Device 300’ s upper and lower conductive boards have a conductive board diameter CBD of about 220.67 mm. Device 300’s conductive tracks may have a radially outer conductive track spacing CTS of about 15.88 mm. Device 300’ s supporting elements may be separated by a supporting element spacing SES of about 180.98 mm.

[0044] FIG. 4 illustrates a graph demonstrating internal wall moisture evolution within a building’s walls after the installation of a device for reduction of moisture in porous materials within the building. FIG. 4 shows results taken from various points in various walls of a building over time. A device for reduction of moisture in porous materials, such as any of devices 100, 200, or 300, was installed within the perimeter of a building’s walls.

[0045] Initial internal wall moisture values (%) were determined at the time of installation of the device at points A-F; these values are illustrated in the rearmost row of bars illustrated in FIG. 4, and identified as (0). At each of points A-F, internal wall moisture values were determined at three different heights (cm). For example, at point A, internal wall moisture values were determined at 10 cm, 25 cm, and 41 cm from the floor.

[0046] After the installation of the device at points A-F, three inspections identified as (1), (2), and (3) were performed, in which internal wall moisture values were determined at points A- F, at the aforementioned three different heights. First inspection (1) values are illustrated in the row just in front of installation (0) values, second inspection (2) values are illustrated in the row just in front of first inspection (1) values, and third inspection (3) values are illustrated in the frontmost row just in front of second inspection (2) values.

[0047] As illustrated in FIG. 4, the internal wall moisture values consistently decreased from installation (0) values through third inspection (3) values.

[0048] To the extent that the term “includes” or “including” is used in the specification or the claims, it is intended to be inclusive in a manner similar to the term “comprising” as that term is interpreted when employed as a transitional word in a claim. Furthermore, to the extent that the term “or” is employed (e.g., A or B) it is intended to mean “A or B or both.” When the applicants intend to indicate “only A or B but not both” then the term “only A or B but not both” will be employed. Thus, use of the term “or” herein is the inclusive, and not the exclusive use. See Bryan A. Gamer, A Dictionary of Modem Legal Usage 624 (2d. Ed. 1995). Also, to the extent that the terms “in” or “into” are used in the specification or the claims, it is intended to additionally mean “on” or “onto.” To the extent that the term “substantially” is used in the specification or the claims, it is intended to take into consideration the degree of precision available or prudent in manufacturing. To the extent that the term “selectively” is used in the specification or the claims, it is intended to refer to a condition of a component wherein a user of the apparatus may activate or deactivate the feature or function of the component as is necessary or desired in use of the apparatus. To the extent that the term “operatively connected” is used in the specification or the claims, it is intended to mean that the identified components are connected in a way to perform a designated function. As used in the specification and the claims, the singular forms “a,” “an,” and “the” include the plural. Finally, where the term “about” is used in conjunction with a number, it is intended to include ± 10% of the number. In other words, “about 10” may mean from 9 to 11.

[0049] As stated above, while the present application has been illustrated by the description of alternative aspects thereof, and while the aspects have been described in considerable detail, it is not the intention of the applicants to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications will readily appear to those skilled in the art, having the benefit of the present application. Therefore, the application, in its broader aspects, is not limited to the specific details, illustrative examples shown, or any apparatus referred to. Departures may be made from such details, examples, and apparatuses without departing from the spirit or scope of the general inventive concept.