CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority from U.S. Provisional Patent Application No. 63/296,143, filed on January 3, 2022, which is incorporated by reference herein in its entirety.

BACKGROUND

[0002] Porous materials, including for example, building materials such as concrete, cement, cinder blocks, bricks, mortar, and the like, often retain and/or allow the passage of moisture therein and/or therethrough. Moisture may initially enter these materials through the exposure of the materials to water from French drains, leaking pipes, runoff, springs, and the like. Subterranean portions of structures, such as basements, are the typical sites of these moisture issues.

[0003] Moisture in these materials can lead to degradation of the material itself (such as weakened mortar between bricks and cinder blocks), potentially dangerous mold and mildew growth within the moist areas, and rust or other corrosion of metal objects contained in the moist areas. Rust of metal structural items, such as beams, posts, joists, ties, and the like can lead to potentially dangerous degradation of the structural integrity of the structure. Rust of metal items such as gas lines can lead to potentially dangerous gas leaks. And finally, high moisture within enclosed subterranean areas is simply uncomfortable and unpleasant to individuals working or living in these areas.

[0004] What is needed is a device for reduction of moisture in porous materials. SUMMARY

[0005] In one aspect, a device for reduction of moisture in porous materials is provided, the device comprising: a conductive board comprising: a first side and a second side, one or more conductive track arranged in a spiral on the first side, one or more conductive track arranged in a spiral on the second side, and a conductive coupler extending from a radially inner core of the second side of the conductive board to a conductive hub, wherein the conductive coupler includes a terminal connected to a switch, and wherein the switch prevents the flow of electricity through the conductive coupler and allows the flow of electricity through the conductive coupler; a primary coil oriented below the conductive board, the primary coil including a coil of wire formed from a conductive material; a plurality of secondary coils oriented below the primary coil, the secondary coils including coils of wire formed from a conductive material.

[0006] In another aspect, a device for reduction of moisture in porous materials is provided, the device comprising: a conductive board comprising: a first side and a second side, three conductive tracks arranged in a spiral on the first side, three conductive tracks arranged in a spiral on the second side, and a conductive coupler extending from a radially inner core of the second side of the conductive board to a conductive hub, wherein the conductive coupler includes a terminal connected to a switch, and wherein the switch prevents the flow of electricity through the conductive coupler and allows the flow of electricity through the conductive coupler; a primary coil oriented below the conductive board, the primary coil including a coil of wire formed from a conductive material; a plurality of secondary coils oriented below the primary coil, the secondary coils including coils of wire formed from a conductive material. BRIEF DESCRIPTION OF THE FIGURES

[0007] The accompanying figures, which are incorporated in and constitute a part of the specification, illustrate various example systems and apparatuses, and are used merely to illustrate various example embodiments. In the figures, like elements bear like reference numerals.

[0008] FIG. 1A illustrates a top perspective view of a device 100 for reduction of moisture in porous materials.

[0009] FIG. IB illustrates a bottom perspective view of device 100 for reduction of moisture in porous materials.

[0010] FIG. 1C illustrates a top perspective view of device 100 with an upper case portion 102 and a lower case portion 104 separated to permit viewing of a conductive board 108 and coils 130, 132 contained within device 100.

[0011] FIG. ID illustrates a top perspective view of device 100 with an upper case portion 102 and a lower case portion 104 separated to permit viewing of conductive board 108 and coils 130, 132 contained within device 100.

[0012] FIG. IE illustrates a top perspective view of device 100 having conductive board 108 and coils 130, 132.

[0013] FIG. IF illustrates a top perspective view of device 100 having conductive board 108 and coils 130, 132.

[0014] FIG. 1G illustrates a top perspective view of device 100 having coils 130, 132. [0015] FIG. 1H illustrates a bottom perspective view of device 100 having conductive board 108 and coils 130, 132.

[0016] FIG. II illustrates a bottom perspective view of device 100 having conductive board 108 and coils 130, 132.

[0017] FIG. 1 J illustrates a top perspective view of device 100 having conductive board 108 and coils 130, 132.

[0018] FIG. 2A illustrates a bottom perspective view of a device 200 for reduction of moisture in porous materials.

[0019] FIG. 2B illustrates a bottom perspective view of device 200.

[0020] FIG. 3A illustrates a sectional view of a device 300 for reduction of moisture in porous materials.

[0021] FIG. 3B illustrates a plan view of device 300.

[0022] FIG. 3C illustrates a plan view of device 300 with an upper case portion removed.

[0023] FIG. 4 illustrates a graph demonstrating internal wall moisture evolution within a building’s walls after the installation of a device for reduction of moisture in porous materials within the building.

DETAILED DESCRIPTION

[0024] FIG. 1A-1J illustrate a device 100 for reduction of moisture in porous materials. Device 100 may include an upper case portion 102 and a lower case portion 104.

[0025] Upper case portion 102 may include a lower edge 120. Lower case portion 104 may include an upper edge 122. Lower edge 120 and upper edge 122 may be configured to mate with one another to form a total enclosure around the interior contents of device 100. Lower case portion 104 may include a base 124 to which at least some of the interior contents of device 100 may be mounted. Upper case portion 102 and lower case portion 104 may be formed from any of a variety of materials, including for example a metal, a polymer, a composite, and the like. Upper case portion 102 and lower case portion 104 may be formed from aluminum. Upper case portion 102 and lower case portion 104 may be coated in an anti-static paint.

[0026] Device 100 may include a fastening aperture 106 on base 124 to permit a user to mount device 100 to a ceiling, wall, post, floor, beam, or the like. Fastening aperture 106 may be a threaded boss fixed to base 124. Fastening aperture 106 may be a hole to permit passage of a bolt, screw, nail, or other fastener from within the interior of device 100. Device 100 may include a threaded rod extending from fastening aperture 106 to aid in handling and/or installation of device 100. That is, the threaded rod may be used to mount device 100 to a structure.

[0027] Device 100 may include elements within upper case portion 102 and lower case portion 104. These elements may include a conductive board 108. Conductive board 108 may be fixed to base 124 of lower case portion 104 through a series of other elements as described below. Conductive board 108, 110 may be round, and one or more supporting element 118 may be oriented at or near the radially outer sides of conductive board 108. One or more supporting element 118 may be made from any of a variety of materials, including for example a metal, a polymer, a composite, and the like. One or more supporting element 118 may be formed from an electrically non-conductive and/or insulative material such as a polymer.

[0028] Conductive board 108 may include one or more conductive track 112. Conductive board 108 may include a plurality of separate conductive tracks 112. Conductive board 108 may include one or more separate conductive tracks 112, 114 on a first (top) side and a second (bottom) side opposite to the first side. Conductive board 108 may include three conductive tracks 112A-112C on a first (top) side, and three conductive tracks 114A-114C on a second (bottom) side opposite to the first side. Conductive board 108 may include more than three conductive tracks 112, 114, including for example four, five, six, or more conductive tracks 112, 114

[0029] Conductive tracks 112A-112C may extend in a clockwise direction from a radially inner portion of board 108 to a radially outer portion of board 108 on the first (top) side. Conductive tracks 114A-114C may extend in a counterclockwise direction from a radially inner portion of board 108 to a radially outer portion of board 108 on the second (bottom) side. Conductive tracks 112A-112C and 114A-114C may extend in opposite directions from one another. Conductive tracks 112A-112C and 114A-114C may extend from a radially inner core portion of board 108 in a spiral shape with an increasing radius until its termination at or near a radially outer portion of board 108.

[0030] Conductive board 108 may be a printed circuit board. Conductive tracks 112, 114 may be made from an electrically conductive material, including for example, a metal such as silver, gold, or copper.

[0031] Conductive tracks 112A-112C may be electrically connected to one another at a radially inner core portion of board 108. Conductive tracks 114A-114C may be electrically connected to one another at a radially inner core portion of board 108. Conductive tracks 112A- 112C may be electrically insulated from one another at a radially inner portion of board 108. Conductive tracks 114A-114C may be electrically insulated from one another at a radially inner portion of board 108. [0032] One or more supporting element 118 may connect at one end to conductive board 108, and at another end to a primary coil 130. Primary coil 130 may be a coil of wire formed from a conductive material, including for example, silver, gold, or copper. Primary coil 130 may be substantially parallel to conductive board 108. Primary coil 130 may be oriented below conductive board 108. One or more supporting element 118 may additionally connect to a primary coil frame member 136. Frame member 136 may include a plurality of arms and a central aperture. The arms may extend to and connect to one or both of primary coil 130 and one or more supporting element 118. Frame member 136 may be made from any of a variety of materials, including for example a metal, a polymer, a composite, and the like. Frame member 136 may be formed from an electrically non-conductive and/or insulative material such as a polymer.

[0033] Device 100 may contain a conductive hub 134 oriented within the perimeter of primary coil 130. Conductive hub 134 may extend through and engage the central aperture of primary coil frame member 136. Conductive hub 134 may be cylindrical in shape, and may be oriented along an axis that is normal to conductive board 108 and/or primary coil 130. Conductive hub 134 may be oriented along an axis that is parallel to or colinear with the axis about which primary coil 130 is coiled.

[0034] An upper end of conductive hub 134 may connect to the second (bottom) side of conductive board 108 by a conductive coupler 150. Conductive coupler 150 may be made from an electrically conductive material, including for example, a metal such as silver, gold, or copper. Conductive coupler 150 may extend from the top of conductive hub 134 to a radially inner core of a second (bottom) side of conductive board 108. The radially inner core of the second (bottom) side of conductive board 108 may be electrically connected to the radially inner core of the first (top) side of conductive board 108.

[0035] Device 100 may include a plurality of secondary coils 132. Each of secondary coils 132 may be a coil of wire formed from a conductive material, including for example, silver, gold, or copper. Each of secondary coils 132 may be connected to a secondary coil frame member 138. Frame members 138 may include a plurality of arms and a central aperture 154. Frame member 138 may be made from any of a variety of materials, including for example a metal, a polymer, a composite, and the like. Frame member 138 may be formed from an electrically non- conductive and/or insulative material such as a polymer.

[0036] Primary coil 130 may be connected directly to, and supported by, the plurality of secondary coils 132. In this manner, primary coil frame member 136, conductive hub 134, conductive coupler 150, and conductive board 108 are supported by the plurality of secondary coils 136.

[0037] Each of secondary coils 132 may be evenly distributed about a circle having an axis colinear with conductive hub 134. Each of secondary coils 132 may be oriented below primary coil 130 and conductive board 108. In one aspect, device 100 may include three secondary coils 132, and each of the three secondary coils 132 is oriented 120 degrees from the adjacent secondary coil 132 taken about an axis colinear with conductive hub 134. Each of secondary coils 132 may be inclined such that the axes about which secondary coils 132 are coiled forms an obtuse angle with the centerline of conductive hub 134 and/or the axis about which primary coil 130 is coiled. This obtuse angle may be between about 90 degrees and about 120 degrees. [0038] In one aspect, device 100 may include more than three secondary coils 132. For example, device 100 may include four secondary coils 132, each oriented 90 degrees from the adjacent secondary coil 132 taken about an axis colinear with conductive hub 134. In another example, device 100 may include five secondary coils 132, each oriented 72 degrees from the adjacent secondary coil 132 taken about an axis colinear with conductive hub 134.

[0039] Through the center of each secondary coil 132 extends an elongated conductor 140. Elongated conductor 140 may be made from a conductive material, such as silver, gold, or copper. Elongated conductor 140 may include two parallel conductor wires. Each elongated conductor 140 may extend from (and electrically connect to) a lower portion 156 of conductive hub 134, through the center of secondary coil 132 and through central aperture 154, and toward lower case portion 104 and/or upper case portion 102 without physically contacting either of lower case portion 104 or upper case portion 102.

[0040] Each of secondary coils 132 may be electrically connected to adjacent secondary coils 132 via a secondary coil connector 152. Connector 152 may be made from a conductive material, such as silver, gold, or copper. In this manner, each of secondary coils 132 are electrically connected to one another.

[0041] At least one connector 152 is directly electrically connected to conductive coupler 150 and/or conductive hub 134 by a secondary coil main connector 158. Secondary coil main connector 158 may be made from a conductive material, such as silver, gold, or copper. In this manner, each secondary coil 132 is electrically connected to conductive coupler 150 and/or conductive hub 134. [0042] Primary coil 130 is electrically connected to conductive coupler 150 and/or conductive hub 134 by a primary coil main connector 160. Primary coil main connector 160 may be made from a conductive material, such as silver, gold, or copper.

[0043] Frame members 138 may be oriented such that a single arm is oriented downwardly and connects to an arm of base frame member 142. Base frame member 142 may include a plurality of arms. One or more base support element 144 may extend from each of the plurality of arms to base 124. Base support elements 144 may be fastened to base 124. As each of the internal elements of device 100 are connected to one another, the connection of base support elements 144 to base 124 secures the entirety of the internal elements of device 100 to lower case portion 104. Base support elements 144 may be made from any of a variety of materials, including for example a metal, a polymer, a composite, and the like. One or more base support element 144 may be formed from an electrically non-conductive and/or insulative material such as a polymer. Base frame member 142 may be made from any of a variety of materials, including for example a metal, a polymer, a composite, and the like. Base frame member 142 may be formed from an electrically non-conductive and/or insulative material such as a polymer.

[0044] FIGS. 2A and 2B illustrate a device 200 for reduction of moisture in porous materials. Device 200 may include an upper case portion 102 and a lower case portion 104.

[0045] A conductive board and a conductive hub may be connected by a conductive coupler 150. Conductive coupler 150 may be made from an electrically conductive material, including for example, a metal such as silver, gold, or copper. Conductive coupler 150 may include a terminal 270 connected to a switch 274 via a wire 272, configured to selectively “break” or “open” conductive coupler 150 to prevent the flow of electricity or other energy through conductive coupler 150. Switch 274 may likewise selectively “close” conductive coupler 150 to allow the flow of electricity or other energy through conductive coupler 150. Switch 274 may be oriented on the exterior of one of upper case portion 102 or lower case portion 104 to permit a user to manipulate the flow of electricity or other energy through conductive coupler 150 from the outside of device 200 when device 200 is assembled and/or installed.

[0046] Device 200 may include one or more protective bumper 276 on one or both of upper case portion 102 and lower case portion 104. Bumpers 276 may be a rubber, polymer, metal, or the like, and designed to prevent damage (e.g., dents, cracks, scrapes, and scratches) to one or both of upper case portion 102 and lower case portion 104.

[0047] Device 200 may include a grounding element 278 connected to one or both of upper case portion 102 and lower case portion 104. Grounding element 278 may be connected to one or both of upper case portion 102 and lower case portion 104 via an electrically conductive stud 280. Grounding element 278 may be a wire or other conductor capable of carrying an electrical current to ground device 200.

[0048] Upper case portion 102, lower case portion 104, and conductive board 108, in each of FIGS. 1A-1J and FIGS. 2A-2B are illustrated as being round/circular in shape. It is contemplated that any of these elements may have any of a variety of alternative shapes, including for example, square, hexagonal, and the like.

[0049] It is contemplated that in either of devices 100 or 200, a non-conductive liner could be placed upon the interior walls of one or both of upper case portion 102 and lower case portion 104. This liner may act as padding to prevent damage to internal components of devices 100 or 200 should those internal components become loose within upper case portion 102 and/or lower case portion 104. EXAMPLE

[0050] FIG. 3A-3C illustrate a device 300 for reduction of moisture in porous materials. In one example arrangement, device 300’ s combined upper and lower case portions have a central diameter CD of about 549.28 mm. Device 300’ s combined upper and lower case portions have a height H of about 479.43 mm.

[0051] Device 300’ s conductive board is oriented at a height CBH from the extreme lower surface of the lower case portion of about 355.60 mm. Device 300’s conductive hub includes a length CHL of about 101.60 mm. Device 300’ s conductive coupler includes a length CCL of about 50.80 mm.

[0052] Device 300’s primary coil includes a diameter PCD of about 215.90 mm and a width PCW of about 30.16 mm. Device 300’s secondary coils include a diameter SCD of about 215.90 mm and a width SCW of about 15.88 mm. The secondary coils are oriented at an angle SCA of about 20 degrees relative to an axis parallel to the conductive hub and the conductive coupler. Device 300’s base support elements have a length SEL of about 76.20 mm.

[0053] Device 300’ s conductive board has a conductive board diameter CBD of about 220.67 mm. Device 300’ s conductive tracks may have a radially outer conductive track spacing CTS of about 15.88 mm. Device 300’s elongated coupler has a length ECL of about 228.60 mm.

[0054] FIG. 4 illustrates a graph demonstrating internal wall moisture evolution within a building’s walls after the installation of a related device for reduction of moisture in porous materials within the building. FIG. 4 shows results taken from various points in various walls of a building over time. A device for reduction of moisture in porous materials, such as any of devices 100, 200, or 300, was installed within the perimeter of a building’s walls.

[0055] Initial internal wall moisture values (%) were determined at the time of installation of the device at points A-D; these values are illustrated in the rearmost row of bars illustrated in FIG. 4, and identified as (0). At each of points A-D, internal wall moisture values were determined at three different heights (cm). For example, at point A, internal wall moisture values were determined at 10 cm, 25 cm, and 40 cm from the floor.

[0056] After the installation of the device at points A-D, four inspections identified as (1), (2), (3), and (4) were performed, in which internal wall moisture values were determined at points A-D, at the aforementioned three different heights. First inspection (1) values are illustrated in the row just in front of installation (0) values, second inspection (2) values are illustrated in the row just in front of first inspection (1) values, third inspection (3) values are illustrated in the row just in front of second inspection (2) values, and fourth inspection (4) values are illustrated in the frontmost row just in front of third inspection (3) values.

[0057] As illustrated in FIG. 4, the internal wall moisture values generally decreased from installation (0) values through fourth inspection (4) values.

[0058] To the extent that the term “includes” or “including” is used in the specification or the claims, it is intended to be inclusive in a manner similar to the term “comprising” as that term is interpreted when employed as a transitional word in a claim. Furthermore, to the extent that the term “or” is employed (e.g., A or B) it is intended to mean “A or B or both.” When the applicants intend to indicate “only A or B but not both” then the term “only A or B but not both” will be employed. Thus, use of the term “or” herein is the inclusive, and not the exclusive use. See Bryan A. Gamer, A Dictionary of Modem Legal Usage 624 (2d. Ed. 1995). Also, to the extent that the terms “in” or “into” are used in the specification or the claims, it is intended to additionally mean “on” or “onto.” To the extent that the term “substantially” is used in the specification or the claims, it is intended to take into consideration the degree of precision available or prudent in manufacturing. To the extent that the term “selectively” is used in the specification or the claims, it is intended to refer to a condition of a component wherein a user of the apparatus may activate or deactivate the feature or function of the component as is necessary or desired in use of the apparatus. To the extent that the term “operatively connected” is used in the specification or the claims, it is intended to mean that the identified components are connected in a way to perform a designated function. As used in the specification and the claims, the singular forms “a,” “an,” and “the” include the plural. Finally, where the term “about” is used in conjunction with a number, it is intended to include ± 10% of the number. In other words, “about 10” may mean from 9 to 11.

[0059] As stated above, while the present application has been illustrated by the description of alternative aspects thereof, and while the aspects have been described in considerable detail, it is not the intention of the applicants to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications will readily appear to those skilled in the art, having the benefit of the present application. Therefore, the application, in its broader aspects, is not limited to the specific details, illustrative examples shown, or any apparatus referred to. Departures may be made from such details, examples, and apparatuses without departing from the spirit or scope of the general inventive concept.