Title:
DEVICE TEMPERATURE ADJUSTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/047529
Kind Code:
A1
Abstract:
A working fluid circulates in this device temperature adjusting apparatus. The device temperature adjusting apparatus is provided with: a heat absorption unit (14) which causes the working fluid to absorb heat from a device (12) to be subjected to temperature adjustment, to evaporate the working fluid; and a heat release unit (16) which is provided above the heat absorption unit, and which causes heat to be released from the working fluid to condense the working fluid. Furthermore, the device temperature adjusting apparatus is provided with: an outward path part (18) having, formed therein, an outward flow path (18a) through which the working fluid flows from the heat release unit to the heat absorption unit; and a return path part (20) having, formed therein, a return flow path (20a) through which the working fluid flows from the heat absorption unit to the heat release unit. Moreover, the device temperature adjusting apparatus is provided with: a bubble generating unit (22) which generates bubbles (14e) in the liquid-phase working fluid which has accumulated in the heat absorption unit; and a control device (24). If the circulation flow rate of the working fluid circulating in a fluid circulation circuit (26) formed from the heat release unit, the outward path part, the heat absorption unit, and the return path part is equal to or lower than a prescribed flow rate (Q1), the control device causes the bubble generating unit to generate bubbles.
Inventors:
TAKEUCHI MASAYUKI (JP)
OMI YASUMITSU (JP)
YAMANAKA TAKASHI (JP)
KATO YOSHIKI (JP)
YOSHINORI TAKESHI (JP)
MIURA KOJI (JP)
OMI YASUMITSU (JP)
YAMANAKA TAKASHI (JP)
KATO YOSHIKI (JP)
YOSHINORI TAKESHI (JP)
MIURA KOJI (JP)
Application Number:
PCT/JP2017/028053
Publication Date:
March 15, 2018
Filing Date:
August 02, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F28D15/06; F28D15/02; H01M10/613; H01M10/625; H01M10/633; H01M10/647; H01M10/652; H01M10/6556; H01M10/6569; H05K7/20
Domestic Patent References:
| WO1999030091A1 | 1999-06-17 |
Foreign References:
| JPS54142842U | 1979-10-03 | |||
| JP2012215375A | 2012-11-08 | |||
| US20050279491A1 | 2005-12-22 | |||
| JP2008527285A | 2008-07-24 | |||
| JPH01252898A | 1989-10-09 | |||
| JP2015041418A | 2015-03-02 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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