Title:
DEVICE TEMPERATURE ADJUSTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/047531
Kind Code:
A1
Abstract:
This device temperature adjusting apparatus is provided with: a device heat exchanger (12) which absorbs heat from a device to be subjected to temperature adjustment, and evaporates a liquid working fluid; and a condenser (14, 14A, 14B) which condenses the working fluid evaporated into a gas by the device heat exchanger. The device temperature adjusting apparatus is further provided with: a gas passage (16) which guides, to the condenser, the working fluid evaporated into a gas by the device heat exchanger; and a liquid passage (18) which guides, to the device heat exchanger, the working fluid condensed into a liquid by the condenser. The device temperature adjusting apparatus is also provided with a supply amount adjustment unit (30) which increases and decreases the amount of the liquid working fluid supplied to the device heat exchanger. When a condition for maintaining the temperature of the device to be subjected to temperature adjustment is established, the supply amount adjustment unit decreases the amount of the liquid working fluid supplied to the device heat exchanger such that the liquid level is formed lower than a region of the device heat exchanger, with the gaseous working fluid interposed therebetween, said region being that which exchanges heat with the device to be subjected to temperature adjustment.
Inventors:
MIURA KOJI (JP)
YAMANAKA TAKASHI (JP)
OMI YASUMITSU (JP)
KATO YOSHIKI (JP)
TAKEUCHI MASAYUKI (JP)
YOSHINORI TAKESHI (JP)
YAMANAKA TAKASHI (JP)
OMI YASUMITSU (JP)
KATO YOSHIKI (JP)
TAKEUCHI MASAYUKI (JP)
YOSHINORI TAKESHI (JP)
Application Number:
PCT/JP2017/028055
Publication Date:
March 15, 2018
Filing Date:
August 02, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F28D15/06; F28D15/02; H01M10/613; H01M10/625; H01M10/633; H01M10/6556; H01M10/6569; H05K7/20
Domestic Patent References:
| WO1999030091A1 | 1999-06-17 |
Foreign References:
| JP2011204154A | 2011-10-13 | |||
| JPS52114157A | 1977-09-24 | |||
| JP2016509147A | 2016-03-24 | |||
| JP2000277177A | 2000-10-06 | |||
| JP2016164478A | 2016-09-08 | |||
| JPH01252834A | 1989-10-09 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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