Title:
DEVICE TEMPERATURE ADJUSTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/047532
Kind Code:
A1
Abstract:
This device temperature adjusting apparatus (1) is provided with: a device heat exchanger (12) which absorbs heat from a device to be subjected to temperature adjustment, and evaporates a liquid working fluid; and a condenser (14) which condenses the working fluid evaporated into a gas by the device heat exchanger. The device temperature adjusting apparatus is provided with: a gas passage (16) which guides, to the condenser, the working fluid evaporated into a gas by the device heat exchanger; and a liquid passage (18) which guides, to the device heat exchanger, the working fluid condensed into a liquid by the condenser. The device temperature adjusting apparatus is further provided with liquid storage units (30, 30A) which are provided so as to branch from a device fluid circuit (10) including the device heat exchanger, the condenser, the gas passage, and the liquid passage, and which store the liquid working fluid present in the device fluid circuit. The device temperature adjusting apparatus is also provided with liquid storage amount adjustment units (40, 60) which increase and reduce the amount of the liquid working fluid stored in the liquid storage units. The liquid storage amount adjustment units are configured so as to increase the amount of the liquid working fluid stored in the liquid storage units, when a condition for maintaining the temperature of the device to be subjected to temperature adjustment has been established.
Inventors:
MIURA KOJI (JP)
YAMANAKA TAKASHI (JP)
OMI YASUMITSU (JP)
KATO YOSHIKI (JP)
TAKEUCHI MASAYUKI (JP)
YOSHINORI TAKESHI (JP)
YAMANAKA TAKASHI (JP)
OMI YASUMITSU (JP)
KATO YOSHIKI (JP)
TAKEUCHI MASAYUKI (JP)
YOSHINORI TAKESHI (JP)
Application Number:
PCT/JP2017/028056
Publication Date:
March 15, 2018
Filing Date:
August 02, 2017
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F28D15/06; F28D15/02; H01M10/613; H01M10/625; H01M10/633; H01M10/6556; H01M10/6569; H05K7/20
Domestic Patent References:
| WO1999030091A1 | 1999-06-17 |
Foreign References:
| JP2011204154A | 2011-10-13 | |||
| JPS52114157A | 1977-09-24 | |||
| JP2016509147A | 2016-03-24 | |||
| JP2000277177A | 2000-10-06 | |||
| JP2016164478A | 2016-09-08 | |||
| JPH01252834A | 1989-10-09 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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