Title:
DIE AND PROCESSING METHOD USING DIE
Document Type and Number:
WIPO Patent Application WO/2021/187499
Kind Code:
A1
Abstract:
Provided are a die and a processing method which uses the die, whereby breakage or wrinkling of a workpiece can be suppressed during bending thereof. A die for bending of a plate-shaped workpiece (100). The present invention comprises a lower die (20) on which the workpiece (100) is loaded, and an upper die (30) in which is formed a pressing surface (32) for pressing the workpiece (100) toward the lower die (20). The lower die (20) comprises a lower movable part (60) which is capable of sliding in the same direction as the movement direction of the upper die (30), a reaction force generating member (70) for elastically supporting the lower movable part (60) from below, and a receiving member (54) positioned on both side parts of the lower movable part (60). The pressing surface (32) has an arcuate cross-sectional shape that is convex toward the lower die (20), and extends along the longitudinal direction of the workpiece (100). The maximally pressed-in position of the lower end part of the pressing surface is at a greater depth than a position that is the inside diameter finished dimension of the workpiece lower than the upper surface of the lower die.
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Inventors:
OHASHI KOHEI (JP)
KATO MITSUNORI (JP)
YAMAZAKI TOSHIAKI (JP)
HORIKAWA SHOICHI (JP)
HORIKAWA HIROYUKI (JP)
DEGUCHI HIDEAKI (JP)
YAMAMOTO MASAHIRO (JP)
KATO MITSUNORI (JP)
YAMAZAKI TOSHIAKI (JP)
HORIKAWA SHOICHI (JP)
HORIKAWA HIROYUKI (JP)
DEGUCHI HIDEAKI (JP)
YAMAMOTO MASAHIRO (JP)
Application Number:
PCT/JP2021/010694
Publication Date:
September 23, 2021
Filing Date:
March 16, 2021
Export Citation:
Assignee:
NIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD (JP)
HORIKAWA IND CO LTD (JP)
HORIKAWA IND CO LTD (JP)
International Classes:
B21D5/01; B21C37/06; B21C37/08
Domestic Patent References:
| WO2018143302A1 | 2018-08-09 |
Foreign References:
| JP2011104623A | 2011-06-02 | |||
| JP2019198872A | 2019-11-21 | |||
| JPH01157716A | 1989-06-21 |
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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