Title:
DIEPOXY COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, AND OPTICAL MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/131132
Kind Code:
A1
Abstract:
The present invention provides: a diepoxy compound from which a cured product having a low water absorption rate is obtained; a curable composition using said diepoxy compound; a cured product; and an optical member. One mode of the present invention pertains to a diepoxy compound represented by formula 1 and a diepoxy compound represented by formula 2. In formulae 1 and 2, at least one R1 is an epoxy group and the remaining R1s are each independently a hydrogen atom or a linear or branched-chain alkyl group having 1-10 carbon atoms. The same applies for R2, R3, and R4.
Inventors:
NISHIMOTO NANAKO (JP)
YOSHIDA JUN (JP)
YOSHIDA JUN (JP)
Application Number:
PCT/JP2021/045379
Publication Date:
June 23, 2022
Filing Date:
December 09, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08G59/02
Foreign References:
| JP2016176030A | 2016-10-06 | |||
| JP2008007566A | 2008-01-17 | |||
| CN106916414A | 2017-07-04 | |||
| JP2004285125A | 2004-10-14 |
Attorney, Agent or Firm:
SHIGA INTERNATIONAL PATENT OFFICE (JP)
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