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Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/131133
Kind Code:
A1
Abstract:
The present invention addresses the problem of improving isolation. In this high-frequency module (100), a first electronic component (1) and a second electronic component (2) are mounted on a principal surface (91) of a mounting substrate (9). A resin layer (5) covers at least an outer peripheral surface (14) of the first electronic component (1) and an outer peripheral surface (24) of the second electronic component (2). An electrically conductive layer (6) covers the resin layer (5), and overlaps the first electronic component (1) and the second electronic component (2) as seen in plan view in the thickness direction (D1) of the mounting substrate (9). The electrically conductive layer (6) includes a first electrically conductive section (61) and a second electrically conductive section (62). The first electrically conductive section (61) is positioned between a first RF terminal (11) of the first electronic component (1) and a second RF terminal (21) of the second electronic component (2) as seen in plan view in the thickness direction (D1). The second electrically conductive section (62) is adjacent to the first electrically conductive section (61) as seen in plan view in the thickness direction (D1). The resistivity of the first electrically conductive section (61) is higher than the resistivity of the second electrically conductive section (62).

Inventors:
KUROYANAGI TAKUMA
Application Number:
PCT/JP2021/045395
Publication Date:
June 23, 2022
Filing Date:
December 09, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L25/04; H01L25/18; H03H9/25; H03H9/64; H03H9/72; H04B1/38; H05K9/00
Domestic Patent References:
WO2016088681A12016-06-09
WO2018181932A12018-10-04
Foreign References:
JP2020115616A2020-07-30
JPS61227040A1986-10-09
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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