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Title:
DISCHARGE SURFACE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2012/035580
Kind Code:
A1
Abstract:
Provided is a discharge surface treatment method for forming a surface layer on a workpiece surface by transferring electrode material to the workpiece (2) by repeatedly generating a pulse-shaped electric discharge between the workpiece (2) and an electrode (1), the electrode (1) used for discharge surface treatment being a silicon solid body, or a molded article formed from powder comprising a hardening material powder to which silicon in the amount of 20wt% or more has been added. The discharge surface treatment method is characterized by: containing a treatment time determination step for setting a discharge surface treatment completion time in a declining process, after an increase in surface roughness formed by the electric discharge on the discharge treatment surface obtained from an observation result based on observation of the discharge treatment surface formed on the workpiece surface by the electric discharge; and by the discharge surface treatment between the electrode and the workpiece only being performed for the treatment time set in the treatment time determination step.

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Inventors:
GOTO AKIHIRO (JP)
SUMI NOBUYUKI (JP)
YASUNAGA YUSUKE (JP)
TERAMOTO HIROYUKI (JP)
Application Number:
PCT/JP2010/005652
Publication Date:
March 22, 2012
Filing Date:
September 16, 2010
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
GOTO AKIHIRO (JP)
SUMI NOBUYUKI (JP)
YASUNAGA YUSUKE (JP)
TERAMOTO HIROYUKI (JP)
International Classes:
C23C26/00
Domestic Patent References:
WO2004033755A12004-04-22
WO2001005545A12001-01-25
Foreign References:
JP2005002880A2005-01-06
JPH0513765B21993-02-23
Other References:
See also references of EP 2617871A4
Attorney, Agent or Firm:
TAKAHASHI, Shogo et al. (JP)
Shogo Takahashi (JP)
Download PDF:
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Claims:



 
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