Title:
DOUBLE-SIDED ADHESIVE SHEET AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/101090
Kind Code:
A1
Abstract:
A double-sided adhesive sheet 1 having, layered in the following order, a second release sheet 15, a second adhesive agent layer 13, a core material 11, a first adhesive agent layer 12, and a first release sheet 14, wherein the first adhesive agent layer 12 and the second adhesive agent layer 13 are formed of a silicone adhesive agent, a release strength P2 when releasing the second release sheet 15 is 30-1000 mN/50 mm, the ratio of an adhesive strength A1 of an adhesive surface of the first adhesive agent layer 12 with respect to the release strength P2 is 10-5000, an adhesive strength B1 of the adhesive surface of the first adhesive agent layer 12 after being heated at 260°C for one minute is 500-15000 mN/25 mm, and the difference in adhesive strength obtained by subtracting, from the adhesive strength B1, an adhesive strength B2 of an adhesive surface of the second adhesive agent layer 13 after being heated at 260°C for one minute, is 1000-20000 mN/25 mm. The double-sided adhesive sheet 1 can be used, without causing any problem, in a production method for a semiconductor device including a step accompanied by heating.
More Like This:
Inventors:
SAIKI NAOYA (JP)
OGASAWARA TAKAFUMI (JP)
SAKAMOTO MISAKI (JP)
OGASAWARA TAKAFUMI (JP)
SAKAMOTO MISAKI (JP)
Application Number:
PCT/JP2017/041530
Publication Date:
June 07, 2018
Filing Date:
November 17, 2017
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C09J183/04
Foreign References:
| JP2011119427A | 2011-06-16 | |||
| JP2016030804A | 2016-03-07 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF: