Title:
DOUBLE-SIDED ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/127395
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a double-sided adhesive for use in wafer support systems, wherein a wafer can be stably separated from a laminate by a relatively simple process such as mechanical peeling. The problem can be resolved by a double-sided adhesive for use in wafer support systems, the double-sided adhesive having one adhesive surface A and another adhesive surface B, wherein the ratio P2/P1 of 10° peel strength P2 between a Si mirror wafer and the adhesive surface B to 10° peel strength P1 between a silicon back surface-grinding support substrate made from borosilicate glass and the adhesive surface A is at least 1.1 as measured while keeping the angle between the separated layers at 10°.
Inventors:
UNEZAKI TAKASHI (JP)
HARUTA KAICHIRO (JP)
TANIMOTO SHUHO (JP)
SUZUKI TAKASHI (JP)
KINOSHITA JIN (JP)
HARUTA KAICHIRO (JP)
TANIMOTO SHUHO (JP)
SUZUKI TAKASHI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2022/044440
Publication Date:
July 06, 2023
Filing Date:
December 01, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
C09J133/14; C09J7/38; C09J175/04; H01L21/02; H01L21/683
Foreign References:
| JP2018203973A | 2018-12-27 | |||
| JP2014072445A | 2014-04-21 | |||
| JP2018059027A | 2018-04-12 | |||
| JP2019186470A | 2019-10-24 | |||
| JP2015232088A | 2015-12-24 | |||
| JP2021097074A | 2021-06-24 | |||
| JP2018044148A | 2018-03-22 | |||
| JP2019056101A | 2019-04-11 |
Attorney, Agent or Firm:
ASAMURA IP P.C. (JP)
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