DRY FILM AND PRINTED WIRING BOARD

WIPO Patent Application WO/2017/122460

A1

To provide: a dry film having a resin layer that has excellent embeddability and planarity; and a printed wiring board which is provided with a cured product that is obtained by curing this dry film. A dry film which comprises a film and a resin layer that is formed on the film and contains an epoxy resin, and which is characterized in that: the resin layer has a melt viscosity of 60-5,500 dPa·s at 100°C; the resin layer has a storage elastic modulus of 80-5,500 Pa at 100°C; the resin layer contains, as the epoxy resin, at least a liquid epoxy resin; and the content of the liquid epoxy resin is less than 60% by mass of the total mass of the epoxy resin.

JP2022118307	PRINTED WIRING BOARD FOR MOUNTING SOLDER BALL THEREON AND MANUFACTURING METHOD THEREOF
JP2008250246	METHOD FOR MANUFACTURING PHOTOSENSITIVE LAMINATE, AND PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
JP3072811	[Title of Invention] Liquid resist ink composition and printed circuit board

ENDO ARATA (JP)
HARIMA EIJI (JP)
CHUJO TAKAYUKI (JP)
OKITSU SATOSHI (JP)
AOYAMA YOSHITOMO (JP)

PCT/JP2016/086192

July 20, 2017

December 06, 2016

Click for automatic bibliography generation  

TAIYO INK MFG CO LTD (JP)

H05K3/28; B32B27/38; C08K9/06; C08L63/00; G03F7/004; G03F7/027

JP2005264109A	2005-09-29
JP2015056480A	2015-03-23
JP2009227992A	2009-10-08
JP2015216317A	2015-12-03
JP2015179829A	2015-10-08

HONDA Ichiro (JP)

View/Download PDF      PDF Help

Previous Patent: METHOD FOR PRODUCING ASHLESS COAL

Next Patent: PRE-PROCESSING DEVICE AND PRE-PROCESSING METHOD