Title:
DRY FILM
Document Type and Number:
WIPO Patent Application WO/2021/210589
Kind Code:
A1
Abstract:
Provided is a curable resin composition with which conductor layer coating can be excellently carried out, and which is suitable for use as an underlayer coating film of an adhesiveness-imparting coating that has excellent adhesion with the coated conductor layer, even when surface irregularities (surface roughness) are small (e.g., even when Ra is 200nm or less). A curable resin composition according to the present invention is for forming an underlayer coating film provided between a base material and an adhesiveness-imparting coating provided in order to improve the adhesion of a coating layer to the base material, the curable resin composition characterized in that: the curable resin composition comprises an epoxy resin (A) and an active ester compound (B); the adhesiveness-imparting coating comprises a catalyzing metal-containing silicon oligomer; and the catalyzing metal-containing silicon oligomer is obtained by subjecting a tetraalkoxy silane and a polyvalent alcohol, in which a hydroxy group is bonded to at least the n and n+1 sites or n and n+2 sites (where n is an integer of at least 1), to a condensation reaction in the presence of a catalyzing metal.
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Inventors:
SEKIGUCHI SHOYA (JP)
ISHIKAWA NOBUHIRO (JP)
TAKAYA YASUKO (JP)
SADOHARA DAISUKE (JP)
SUZUKI YOHEI (JP)
ISHIKAWA NOBUHIRO (JP)
TAKAYA YASUKO (JP)
SADOHARA DAISUKE (JP)
SUZUKI YOHEI (JP)
Application Number:
PCT/JP2021/015358
Publication Date:
October 21, 2021
Filing Date:
April 13, 2021
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
JCU CORP (JP)
JCU CORP (JP)
International Classes:
B32B27/30; B32B27/38; H05K1/03
Domestic Patent References:
| WO2017130373A1 | 2017-08-03 |
Foreign References:
| JPH07304931A | 1995-11-21 | |||
| JP2007150221A | 2007-06-14 |
Attorney, Agent or Firm:
ITOH, Atsushi (JP)
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