CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, WIRING BOARD, AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2021/210588

A1

Provided is a curable resin composition with which it is possible to achieve excellent adhesion between an insulation layer and a conductor layer, even when the surface irregularities (surface roughness) are small (e.g., even when Ra is 200nm or less). A curable resin composition according to the present invention comprises an epoxy resin, a catalyzing metal-containing silicon oligomer, a phenol resin and an active ester compound, the curable resin composition characterized in that: the epoxy resin contains a bisphenol A-type epoxy resin, a biphenyl aralkyl-type epoxy resin, and an epoxy resin other than the bisphenol A-type epoxy resin and biphenyl aralkyl-type epoxy resin; and the catalyzing metal-containing silicon oligomer is obtained by subjecting a tetraalkoxy silane and a polyvalent alcohol, in which a hydroxy group is bonded to at least the n and n+1 sites or n and n+2 sites (where n is an integer of at least 1), to a condensation reaction in the presence of a metal having catalytic properties with respect to electroless plating.

SEKIGUCHI SHOYA (JP)
ISHIKAWA NOBUHIRO (JP)
TAKAYA YASUKO (JP)
SADOHARA DAISUKE (JP)
SUZUKI YOHEI (JP)

PCT/JP2021/015357

October 21, 2021

April 13, 2021

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TAIYO HOLDINGS CO LTD (JP)
JCU CORP (JP)

C08G59/40; B01J27/13; C08L63/00; H05K3/28; H05K3/46

WO2017130373A1

2017-08-03

JPH07304931A	1995-11-21
JP2011063653A	2011-03-31
JP2016210993A	2016-12-15
JPH1187927A	1999-03-30

ITOH, Atsushi (JP)

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