Title:
EASY-BOND FILM, METHOD FOR MANUFACTURING SAME, POLARIZING PLATE, AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/029127
Kind Code:
A1
Abstract:
An easy-bond film (1) comprises an easy-bond layer (15) on the surface of a transparent film substrate (11). The easy-bond layer (15) contains a binder resin and microparticles. The thickness of the easy-bond layer is preferably 120–260 nm, and the average primary particle size of the microparticles is preferably 0.1–0.9 times the thickness of the easy-bond layer. An easy-bond composition containing the binder resin or a precursor thereof, the microparticles, an alkali component, and a solvent can be applied to the transparent film substrate and heated to form the easy-bond layer.
Inventors:
MICHISHITA SORA (JP)
SHINAGAWA MASASHI (JP)
ITONAGA KAREN (JP)
KONNO HIROSHI (JP)
SHINAGAWA MASASHI (JP)
ITONAGA KAREN (JP)
KONNO HIROSHI (JP)
Application Number:
PCT/JP2020/022415
Publication Date:
February 18, 2021
Filing Date:
June 05, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/18; B32B7/023; B32B27/30; B32B27/40; C09D5/00; C09D7/61; C09D175/04; C09D201/00; C09J7/50; G02B5/30; H01L27/32; H01L51/50; H05B33/02
Domestic Patent References:
| WO2014074943A1 | 2014-05-15 |
Foreign References:
| JP2018118438A | 2018-08-02 |
Attorney, Agent or Firm:
SHINTAKU, Masato (JP)
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