Title:
ELASTIC WAVE DEVICE, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/022931
Kind Code:
A1
Abstract:
This elastic wave device (1) comprises a piezoelectric substrate (10), an IDT electrode (11), a wiring line (14), a pad (20), an underbump metal (18), a first dielectric layer (15) and a second dielectric layer (16). At least a part of the IDT electrode (11) is configured of a first conductive film (41); at least a part of the wiring line (14) is configured of a laminate that comprises the first conductive film (41) and a second conductive film (42); and at least a part of the pad (20) is configured of the second conductive film (42). The second dielectric layer (16) is formed to cover a region (NC) other than a contact region (C) of the second conductive film (42) and the underbump metal (18). Consequently, the second conductive film (42) is covered by the second dielectric layer (16) and the underbump metal (18), and thus is not exposed to the atmosphere.
Inventors:
MIWA YUJI (JP)
SUMII HIJIRI (JP)
YASUDA JUNPEI (JP)
KIKUCHI TAKU (JP)
YAMAZAKI HISASHI (JP)
SUMII HIJIRI (JP)
YASUDA JUNPEI (JP)
KIKUCHI TAKU (JP)
YAMAZAKI HISASHI (JP)
Application Number:
PCT/JP2014/071172
Publication Date:
February 19, 2015
Filing Date:
August 11, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H3/08; H03H9/145
Domestic Patent References:
| WO2005002049A1 | 2005-01-06 |
Foreign References:
| JP2012065092A | 2012-03-29 | |||
| JP2011244065A | 2011-12-01 | |||
| JP2010130031A | 2010-06-10 | |||
| JP2007329584A | 2007-12-20 | |||
| JP2005117151A | 2005-04-28 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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