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Title:
ELASTIC WAVE DEVICE AND ELASTIC WAVE MODULE
Document Type and Number:
WIPO Patent Application WO/2016/067873
Kind Code:
A1
Abstract:
Provided are an elastic wave device and an elastic wave module, each of which has large out-of-band attenuation. This elastic wave device 1 is provided with: a first piezoelectric substrate 2A that has first and second main surfaces 2Aa, 2Ab; a second piezoelectric substrate 2B that has first and second main surfaces 2Ba, 2Bb, while having a thickness larger than the thickness of the first piezoelectric substrate 2A; and ground terminals 5a, 5b that are formed on the second main surface 2Ab of the first piezoelectric substrate 2A. The piezoelectric substrates are joined such that the first main surface 2Aa of the first piezoelectric substrate 2A and the first main surface 2Ba of the second piezoelectric substrate 2B face each other. A first elastic wave filter is configured on the first main surface 2Aa of the first piezoelectric substrate 2A. A second elastic wave filter is configured on the first main surface 2Ba of the second piezoelectric substrate 2B. The out-of-band attenuation of the first elastic wave filter is larger than the out-of-band attenuation of the second elastic wave filter.

Inventors:
NAKAMURA SOICHI (JP)
Application Number:
PCT/JP2015/078582
Publication Date:
May 06, 2016
Filing Date:
October 08, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/64; H03H9/25; H03H9/72
Domestic Patent References:
WO2011102049A12011-08-25
WO2006024262A12006-03-09
Foreign References:
JP2002043890A2002-02-08
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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