Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/282264
Kind Code:
A1
Abstract:
The present invention suppresses warping of a piezoelectric layer. An elastic wave device comprising: a support substrate having a thickness in a first direction; an intermediate layer provided on the support substrate; a piezoelectric layer provided on the intermediate layer; and an IDT electrode provided on a main surface of the piezoelectric layer and including first electrode fingers extending in a second direction intersecting the first direction, a first busbar electrode to which the first electrode fingers are connected, a second electrode finger opposing one of the first electrode fingers in a third direction orthogonal to the second direction and extending in the second direction, and a second busbar electrode to which the second electrode finger is connected. The intermediate layer has a space portion in a region at least partly overlapping the IDT electrode when viewed in plan in the first direction. The space portion of the intermediate layer has an inner wall with at least one notch.
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Inventors:
KIMURA TETSUYA (JP)
Application Number:
PCT/JP2022/026738
Publication Date:
January 12, 2023
Filing Date:
July 05, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2021060513A1 | 2021-04-01 |
Foreign References:
| JP2012257019A | 2012-12-27 | |||
| US20210013860A1 | 2021-01-14 | |||
| JP2018207524A | 2018-12-27 | |||
| JP2010056736A | 2010-03-11 | |||
| JP2017224890A | 2017-12-21 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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