Title:
ELASTIC WAVE FILTER, METHOD FOR MANUFACTURING ELASTIC WAVE FILTER, HIGH-FREQUENCY MODULE, AND COMMUNICATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/176738
Kind Code:
A1
Abstract:
An elastic wave filter having increased reliability of connection of a via and an electrically conductive member and capable of suppressing degradation of filter characteristics is provided. The elastic wave filter (2) is provided with a piezoelectric substrate (41), an IDT electrode (42), an electrically conductive member (43), an external terminal (45), and a via (44). The via (44) extends through the piezoelectric substrate (41) in a thickness direction (D1), and connects the external terminal (45) and the electrically conductive member (43). In a cross section view of the piezoelectric substrate (41): the via (44) intersects a first main surface (41a) and a second main surface (41b) at a first intersecting point (P1) and a second intersecting point (P2), respectively; the via (44) has an outer peripheral surface (44c) with an inclination changing at a change point (P3); the change point (P3) and the second intersecting point (P2) are connected by a first line segment (H1) forming an acute angle of a first angle (α) with the second main surface (41b); and the change point (P3) and the first intersecting point (P1) are connected by a second line segment (H2) forming an acute angle of a second angle (β) with a virtual line (L1). The virtual line (L1) passes through the change point (P3) and is parallel to the second main surface (41b). The second angle (β) is greater than the first angle (α).
Inventors:
TSUDA MOTOJI
KAI SEIJI
YAMAZAKI HISASHI
KAI SEIJI
YAMAZAKI HISASHI
Application Number:
PCT/JP2022/005133
Publication Date:
August 25, 2022
Filing Date:
February 09, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H03H3/08; H03H9/25
Domestic Patent References:
| WO2016084936A1 | 2016-06-02 | |||
| WO2018143044A1 | 2018-08-09 |
Foreign References:
| JP2020156059A | 2020-09-24 | |||
| US20160204761A1 | 2016-07-14 | |||
| JP2006210994A | 2006-08-10 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
Download PDF:
Previous Patent: RADIO WAVE-REFLECTING PLATE
Next Patent: SENSOR PACKAGE, SENSOR MODULE, AND SENSOR DEVICE
Next Patent: SENSOR PACKAGE, SENSOR MODULE, AND SENSOR DEVICE