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Patent Searching and Data


Title:
SENSOR PACKAGE, SENSOR MODULE, AND SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/176739
Kind Code:
A1
Abstract:
A sensor package 10 includes a plurality of sensors 19, and a container 18. The sensors 19 detect a component to be detected in a fluid. The container 18 has an internal flow passage 21, and a first surface os1. The plurality of sensors 19 are provided in the internal flow passage 21. The internal flow passage 21 allows the fluid to flow. An inflow port 25 to the internal flow passage 21 and an outflow port 25 from the internal flow passage 21 are formed in the first surface os1. An electrode group that is electrically connected to the plurality of sensors 19 is provided in a surface of the container 18 different from the first surface os1.

Inventors:
SAKAI HISASHI (JP)
TAJIMA MASAHIKO (JP)
MAEHARA TADATOMO (JP)
YOSHIKAWA MASAMI (JP)
Application Number:
PCT/JP2022/005139
Publication Date:
August 25, 2022
Filing Date:
February 09, 2022
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
G01N5/02; G01N27/04
Domestic Patent References:
WO2020189785A12020-09-24
Foreign References:
JP2018100900A2018-06-28
JP2011053049A2011-03-17
JP2017101949A2017-06-08
EP2952886A12015-12-09
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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