ELECTRICAL CIRCUIT APPARATUS AND METHOD FOR ASSEMBLING SAME

Title:

ELECTRICAL CIRCUIT APPARATUS AND METHOD FOR ASSEMBLING SAME

Document Type and Number:

WIPO Patent Application WO2005039254

Kind Code:

A3

Abstract:

An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

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Inventors:

WALDVOGEL JOHN M (US)
BIELICK BRIAN R (US)
MILLER HERMAN J (US)
VAN CANNON BILLY J (US)

Application Number:

PCT/US2004/030755

Publication Date:

June 16, 2005

Filing Date:

September 17, 2004

Export Citation:

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Assignee:

MOTOROLA INC (US)
WALDVOGEL JOHN M (US)
BIELICK BRIAN R (US)
MILLER HERMAN J (US)
VAN CANNON BILLY J (US)

International Classes:

H05K1/02; H05K1/18; H05K3/00; H05K3/34; H05K3/38; H05K3/40; (IPC1-7): H05K7/20

Foreign References:

US4030001A	1977-06-14
US6011692A	2000-01-04
US6449158B1	2002-09-10
US6537857B2	2003-03-25
US6635958B2	2003-10-21

Other References: