ELECTRICALLY CONDUCTIVE PARTICLE, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR MANUFACTURING SAME, AND CONNECTION STRUCTURE BODY AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2023/171633

A1

This electrically conductive particle P for an adhesive film for circuit connection comprises a mother particle 31 having electrical conductivity, and child particles 32 that cover the surface of the mother particle 31, wherein, with the particle radius and the particle diameter of the child particles 32 as determined through observation by SEM at a magnification rate of 30000 times respectively represented by rX and dX, and the average particle size, which is the average value of the particle diameter dX, represented by dY, the degree of heteromorphy of the particles 32 determined by formula (1) below is more than 2.0.　Formula (1): Degree of heteromorphy = D/rY×100 [In formula (1), rY indicates a virtual sphere having a diameter equal to dY, and D indicates an average value of an absolute difference between the particle radius rX of the child particle 32 and the radius rY of the virtual sphere.

MATSUZAWA MITSUHARU (JP)
TOMISAKA KATSUHIKO (JP)
YAMAZAKI SHOHEI (JP)
SEKI HIDEYUKI (JP)
MATSUZAKI TOSHIAKI (JP)

PCT/JP2023/008421

September 14, 2023

March 06, 2023

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RESONAC CORP (JP)

H01B5/00; C09J7/35; H01B1/00; H01B1/22; H01B5/16; H01R11/01; H01R43/00

JP2015079717A	2015-04-23
JP2013251099A	2013-12-12
JP2010103080A	2010-05-06
JP2020013786A	2020-01-23

HASEGAWA Yoshiki et al. (JP)

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