CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION STRUCTURE, AND PRODUCTION METHOD THEREFOR

Title:

CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION STRUCTURE, AND PRODUCTION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2023/171634

Kind Code:

A1

Abstract:

Conductive particles P for an adhesive film for circuit connection, said conductive particles P each comprising a conductive parent particle 31 and child particles 32 covering the surface of the parent particle 31, wherein the ratio of the average particle size of the child particles 32 in methyl ethyl ketone to the average particle size of the child particles 32 in water is greater than 1.15 but not greater than 1.30.

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Inventors:

MATSUZAWA MITSUHARU (JP)
YAMAZAKI SHOHEI (JP)
TOMISAKA KATSUHIKO (JP)
MATSUZAKI TOSHIAKI (JP)
SEKI HIDEYUKI (JP)

Application Number:

PCT/JP2023/008422

Publication Date:

September 14, 2023

Filing Date:

March 06, 2023

Export Citation:

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Assignee:

RESONAC CORP (JP)

International Classes:

H01B5/00; C09J7/35; H01B1/00; H01B1/22; H01B5/16; H01R11/01; H01R43/00

Foreign References:

JP2012155958A	2012-08-16
JP2013251099A	2013-12-12
JP2010103080A	2010-05-06
JP2020013786A	2020-01-23

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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