Title:
ELECTROCONDUCTIVE ADHESIVE AND ELECTROMAGNETIC SHIELD FILM
Document Type and Number:
WIPO Patent Application WO/2024/029513
Kind Code:
A1
Abstract:
Provided is an electroconductive adhesive which has both a high creep resistance at high temperatures and high adhesivity. This electroconductive adhesive is a sheet-type electroconductive adhesive comprising: electroconductive particles; a resin composition; a first main surface; and a second main surface opposing the first main surface. The conductive adhesive is characterized in that: the storage elastic modulus thereof at 65°C is 1.6×104Pa or more; and the arithmetic roughness Ra of the first main surface is 4 μm or less.
Inventors:
TAKESHITA SIGEKI (JP)
TAKAMI KOUJI (JP)
TAKAMI KOUJI (JP)
Application Number:
PCT/JP2023/028059
Publication Date:
February 08, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J7/38; C09J7/10; C09J9/02; C09J11/04; C09J201/00; H05K9/00
Foreign References:
| JP2019201073A | 2019-11-21 | |||
| JP2014234444A | 2014-12-15 | |||
| JP2015028146A | 2015-02-12 | |||
| JP2006135118A | 2006-05-25 | |||
| JP2013170197A | 2013-09-02 | |||
| JP2014145828A | 2014-08-14 | |||
| JP2014154671A | 2014-08-25 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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