Title:
THERMAL HEAD AND THERMAL PRINTER
Document Type and Number:
WIPO Patent Application WO/2024/029512
Kind Code:
A1
Abstract:
A thermal head comprises a substrate (7), a bonding material (24), a conductive member (11b), and an aluminum electrode (19). The bonding material (24) is positioned above the substrate (7) and contains gold and tin. The conductive member (11b) is positioned on the bonding material (24). The aluminum electrode (19) is positioned on the substrate (7) and is electrically connected to the conductive member (11b) with the bonding material (24) therebetween.
Inventors:
KATO KENICHI (JP)
MIYAMOTO MAKOTO (JP)
MIYAMOTO MAKOTO (JP)
Application Number:
PCT/JP2023/028057
Publication Date:
February 08, 2024
Filing Date:
August 01, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
B41J2/335; B41J2/345
Domestic Patent References:
| WO2021200729A1 | 2021-10-07 |
Foreign References:
| JP2016203526A | 2016-12-08 | |||
| JPH06133127A | 1994-05-13 | |||
| JP2005324407A | 2005-11-24 | |||
| JPH11240190A | 1999-09-07 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF:
Previous Patent: EVALUATION METHOD, COMPLEX, AND KIT
Next Patent: ELECTROCONDUCTIVE ADHESIVE AND ELECTROMAGNETIC SHIELD FILM
Next Patent: ELECTROCONDUCTIVE ADHESIVE AND ELECTROMAGNETIC SHIELD FILM