Title:
ELECTROCONDUCTIVE ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2022/202560
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electroconductive adhesive layer which has excellent connection stability between adherends that are electroconductive members and which, even at high temperatures, retains the connection stability. The electroconductive adhesive layer (1) comprises a binder component (11) and electroconductive particles (12), wherein the electroconductive particles (12) comprise electroconductive particles A (12a) having a median diameter which is 100% or greater with respect to the thickness (T) of the electroconductive adhesive layer (1) and electroconductive particles B (12b) having a median diameter which is 1-50% with respect to the median diameter of the electroconductive particles A (12a) and the electroconductive particles (12) are contained in an amount of 110-900 parts by mass per 100 parts by mass of the binder component (11), the mass ratio between the electroconductive particles A (12a) and the electroconductive particles B (12b), (electroconductive particles A)/(electroconductive particles B), being 0.1-7.2.
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Inventors:
HARUNA YUUSUKE (JP)
TAJIMA HIROSHI (JP)
TAJIMA HIROSHI (JP)
Application Number:
PCT/JP2022/011981
Publication Date:
September 29, 2022
Filing Date:
March 16, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01B1/22; H05K9/00
Domestic Patent References:
| WO2019131904A1 | 2019-07-04 | |||
| WO2018043505A1 | 2018-03-08 |
Foreign References:
| JP2019110282A | 2019-07-04 | |||
| JP2019065062A | 2019-04-25 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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