Title:
ELECTROCONDUCTIVE PASTE, ELECTRODE, AND CHIP RESISTOR
Document Type and Number:
WIPO Patent Application WO/2020/021872
Kind Code:
A1
Abstract:
The present invention provides a highly chemically resistant electroconductive paste capable of forming a low-resistance electrode. This electroconductive paste contains (A) a silver powder, (B) glass frit, (C) a silica filler, and (D) a thermoplastic resin. Glass frit (B) contains SiO2 and TiO2. The mass ratio between the SiO2 contained in glass frit (B) and the SiO2 contained in silica filler (C) is 1: (0.25‒1.6). The content of glass frit (B) is less than 20 mass parts relative to 100 mass parts of silver powder (A).
Inventors:
YOSHII YOSHIAKI (JP)
Application Number:
PCT/JP2019/022355
Publication Date:
January 30, 2020
Filing Date:
June 05, 2019
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01B1/22; C03C8/24; H01B1/00; H01B5/14; H05K1/09
Domestic Patent References:
| WO2018037746A1 | 2018-03-01 |
Foreign References:
| JP2003338218A | 2003-11-28 | |||
| JP2000048643A | 2000-02-18 | |||
| JP2016538708A | 2016-12-08 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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