Title:
ELECTROCONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2020/040138
Kind Code:
A1
Abstract:
This electroconductive paste contains a copper-containing metal powder, a glass composition, and an organic vehicle, and is characterized in that the glass composition contains sulfur (S), and the sulfur (S) content is 10 ppm to 370 ppm relative to the metal powder. The present invention can provide a conductive paste wherein the sintering behavior of a copper-containing metal powder is appropriately controlled, thereby ensuring a wide sintering window and reducing the frequency of defects such as voids and glass float after sintering.
Inventors:
ESAKI SOICHIRO (JP)
TATENO HAYATO (JP)
NISHIOKA NOBUO (JP)
TATENO HAYATO (JP)
NISHIOKA NOBUO (JP)
Application Number:
PCT/JP2019/032446
Publication Date:
February 27, 2020
Filing Date:
August 20, 2019
Export Citation:
Assignee:
SHOEI CHEMICAL IND CO (JP)
International Classes:
H01B1/22; H01G4/30; H05K1/09
Foreign References:
| JPS63308803A | 1988-12-16 | |||
| JP2004179182A | 2004-06-24 | |||
| JPH05242725A | 1993-09-21 | |||
| JP2013072091A | 2013-04-22 |
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
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