Title:
ELECTROCONDUCTIVE RESIN COMPOSITION AND ELECTRONIC PARTS USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2003/035739
Kind Code:
A1
Abstract:
An electroconductive resin composition which comprises a silver−plated cooper powder (a1) having an aspect ratio of 1 to 20, an electroconductive powder containing a silver powder (A1), a thermoplastic resin (B1) having one or more functional groups selected from the group consisting of an amide group, an ester group, an imide group and en ether group, and an organic solvent (C)&semi an electroconductive resin composition which comprises a silver−plated cooper powder (a2) having cooper exposed on a part of the surface thereof, an electroconductive powder (A2) containing a silver powder, the above thermoplastic resin (B1), and an organic solvent (C)&semi an electroconductive resin composition which comprises the electroconductive powder (A1), a thermoplastic resin (B2) selected from the group consisting of a polyamide silicone resin, a polyamideimide silicone resin and a polyimide silicone resin, and an organic solvent (C)&semi and an electroconductive resin composition which comprises the above electroconductive powder (A2), the above thermoplastic resin (B2) and an organic solvent (C).
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Inventors:
SHIMIZU TAKEHIRO (JP)
MATSUURA HIDEKAZU (JP)
MATSUURA HIDEKAZU (JP)
Application Number:
PCT/JP2002/010830
Publication Date:
May 01, 2003
Filing Date:
October 18, 2002
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
SHIMIZU TAKEHIRO (JP)
MATSUURA HIDEKAZU (JP)
SHIMIZU TAKEHIRO (JP)
MATSUURA HIDEKAZU (JP)
International Classes:
H01B1/22; (IPC1-7): C08L1/02; C08G69/26; C08G73/10; C08K3/08; C08K9/02; H01B1/00; H01B1/22
Foreign References:
| JP2001351436A | 2001-12-21 | |||
| JP2000007824A | 2000-01-11 | |||
| JPH08199041A | 1996-08-06 | |||
| JPH08161930A | 1996-06-21 |
Attorney, Agent or Firm:
Miyoshi, Hidekazu (Toranomon Daiichi Building 2-3, Toranomon 1-chom, Minato-ku Tokyo, JP)
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