Title:
ELECTRODE-EQUIPPED HONEYCOMB SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/117431
Kind Code:
A1
Abstract:
An electrode-equipped honeycomb substrate (1) has: a conductive ceramic honeycomb substrate (2) which generates heat when current is passed therethrough; and a pair of electrodes (3) which are provided so as to face the outer peripheral surface of the honeycomb substrate (2). The thermal expansion coefficient of the electrodes (3) is higher than that of the honeycomb substrate (2). The honeycomb substrate (2) can include silicon particles. The electrode (3) can include silicon particles. The honeycomb substrate (2) and/or the electrodes (3) can include an oxide which contains silicon and boron.
Inventors:
KASAI KOJI (JP)
Application Number:
PCT/JP2020/042886
Publication Date:
June 17, 2021
Filing Date:
November 18, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
B01D53/94; F01N3/20
Domestic Patent References:
| WO2013008664A1 | 2013-01-17 |
Foreign References:
| JP2016186262A | 2016-10-27 | |||
| JP2014155884A | 2014-08-28 | |||
| JPH0722160A | 1995-01-24 | |||
| JPH02144874A | 1990-06-04 |
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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