Title:
SIGNAL TRANSMISSION CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2021/117432
Kind Code:
A1
Abstract:
A signal transmission circuit that is for transmitting an isolated signal and comprises: a multilayer board that includes a plurality of layers; and a pattern transformer that is provided to the multilayer board. The pattern transformer includes: a primary-side winding that includes coil-shaped printed pattern wirings that are provided in each of a first planar region and a second planar region of the multilayer board; and a secondary-side winding that is provided at a different location in the layering direction than the primary-side winding and includes coil-shaped printed pattern wirings that are provided in each of the first planar region and the second planar region of the multilayer board. The primary-side winding and the secondary-side winding are electromagnetically coupled and are configured such that current flows clockwise in one of the coil-shaped printed pattern wirings that are provided in the first planar region and the coil-shaped printed pattern wirings that are provided in the second planar region and such that current flows counterclockwise in the other.
Inventors:
EMOTO HIDEAKI (JP)
Application Number:
PCT/JP2020/042887
Publication Date:
June 17, 2021
Filing Date:
November 18, 2020
Export Citation:
Assignee:
MITSUBISHI POWER LTD (JP)
International Classes:
H01F17/00; H01F19/00; H01F27/00; H05K1/16
Domestic Patent References:
| WO2018211912A1 | 2018-11-22 |
Foreign References:
| JP2007250891A | 2007-09-27 | |||
| JPH09283335A | 1997-10-31 | |||
| JPH04185396A | 1992-07-02 | |||
| JP2004274262A | 2004-09-30 | |||
| JP2018102119A | 2018-06-28 |
Attorney, Agent or Firm:
SEISHIN IP PATENT FIRM, P.C. (JP)
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