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Title:
ELECTRODE PLATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/070937
Kind Code:
A1
Abstract:
This electrode plate processing apparatus comprises: a plurality of processing rollers (32) that each have a width narrower than the width of an electrode plate (100) and that form hole portions (103) in a processing surface of the electrode plate (100); and a plurality of support mechanisms (34) each independently supporting each of the processing rollers (32). Each of the processing rollers (32) comprises a metal plate (33) that is affixed to the surface of a cylindrical roller body (32a), and that has a plurality of projections (33a). Only one metal plate (33) is provided in the axial direction of each processing roller (32). The processing rollers (32) that are adjacent to each other in the width direction of the electrode plate (100) are displaced from each other in the circumferential direction of a back-up roller (40).

Inventors:
SAKAKIBARA KENJI (JP)
Application Number:
PCT/JP2023/034473
Publication Date:
April 04, 2024
Filing Date:
September 22, 2023
Export Citation:
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Assignee:
YASUNAGA KK (JP)
International Classes:
H01M4/04; B21D22/02; B21D53/00; B26F1/20; H01G13/00
Foreign References:
JP2008010253A2008-01-17
JP2008226502A2008-09-25
KR20180114380A2018-10-18
KR101847818B12018-04-12
CN210837940U2020-06-23
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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