Title:
ELECTRODE PLATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/070938
Kind Code:
A1
Abstract:
This electrode plate processing apparatus comprises: a plurality of die devices (31) each having a processing roller (32) for forming holes (103) in a work surface of an electrode plate (100); and a back-up roller (40) for holding the electrode plate (100) between itself and each processing roller (32). A single metal plate (33) having a plurality of projections (33a) has been affixed to the processing roller (32) along the axial direction of the processing roller (32). Each die device (31) includes a die-processing cylinder (38) from which the processing roller (32) is suspended and which pushes the processing roller (32) against the back-up roller (40) independently of the other die devices (31).
Inventors:
SAKAKIBARA KENJI (JP)
Application Number:
PCT/JP2023/034474
Publication Date:
April 04, 2024
Filing Date:
September 22, 2023
Export Citation:
Assignee:
YASUNAGA KK (JP)
International Classes:
H01M4/04; B21D22/02; B21D53/00; B26F1/20; H01G13/00
Foreign References:
| JP2008010253A | 2008-01-17 | |||
| JP2008226502A | 2008-09-25 | |||
| KR20180114380A | 2018-10-18 | |||
| KR101847818B1 | 2018-04-12 | |||
| CN210837940U | 2020-06-23 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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