Title:
ELECTROLESS PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2008/056537
Kind Code:
A1
Abstract:
This invention provides an electroless plating method comprising electrolessly
plating the surface of a metal base sample (22) using a supercritical fluid or
a subcritical fluid in such a state that a metal powder is dispersed in an electroless
plating liquid (19). According to this method, a homogeneous and thick plating
layer is formed in a short time by taking advantage of an induction eutectoid phenomenon.
In the electroless plating method, the metal powder may have an average particle
diameter of not less than 1 nm and not more than 100 μm, and the electroless
plating method may also be applied to a damascene process or a dual damascene process
which is a method for forming a fine metal wiring within a semiconductor element.
The above constitution can provide an electroless plating method which can
realize the formation of an even film by electroless plating in a short time using
a subcritical fluid or a supercritical fluid by taking advantage of an induction
eutectoid phenomenon.
Inventors:
MIYATA SEIZO (JP)
SHIMIZU TETSUYA (JP)
TAJIMA HISAYOSHI (JP)
SONE MASATO (JP)
SHIMIZU TETSUYA (JP)
TAJIMA HISAYOSHI (JP)
SONE MASATO (JP)
Application Number:
PCT/JP2007/070692
Publication Date:
May 15, 2008
Filing Date:
October 24, 2007
Export Citation:
Assignee:
SES CO LTD (JP)
MYATA SEIZO (JP)
SHIMIZU TETSUYA (JP)
TAJIMA HISAYOSHI (JP)
SONE MASATO (JP)
MYATA SEIZO (JP)
SHIMIZU TETSUYA (JP)
TAJIMA HISAYOSHI (JP)
SONE MASATO (JP)
International Classes:
H01L21/288; C23C18/31
Foreign References:
| JPH10245683A | 1998-09-14 | |||
| JPH0868885A | 1996-03-12 | |||
| JP2003321798A | 2003-11-14 | |||
| JPH08158097A | 1996-06-18 | |||
| JP2003096596A | 2003-04-03 | |||
| JP2005259959A | 2005-09-22 | |||
| JPH10245683A | 1998-09-14 | |||
| JP2006037188A | 2006-02-09 |
Attorney, Agent or Firm:
WIN TECH PATENT OFFICE (Uchikanda-Shibuya Bldg. 16-11, Uchikanda 2-chome, Chiyoda-k, Tokyo 47, JP)
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