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Patent Searching and Data


Title:
ELECTROMAGNETIC INDUCTIVE HEATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/108820
Kind Code:
A1
Abstract:
The present invention relates to an electromagnetic inductive heating device for bonding a sheet to anchoring members comprising a conductive base and a thermoplastic resin layer, characterized by bonding the anchoring members to the sheet by heat deposition of the thermoplastic resin layer by heating of the conductive base, said device comprising: a heating means for heating the conductive base via the sheet by electromagnetic induction; a temperature measurement means for measuring the temperature of the sheet; and a heating time setting means for setting heating time by the heating means according to the temperature of the sheet. With the present invention, it is possible to provide an electromagnetic inductive heating device with which it is possible to desirably bond the anchoring members and the sheet even if there are large temperature changes in a covering surface due to seasons, weather, etc., and to reliably anchor a sheet, uniformly and without unevenness, to all anchoring members even if time is required to lay down the sheet.

Inventors:
YOSHIKAWA SOICHI (JP)
Application Number:
PCT/JP2013/050764
Publication Date:
July 25, 2013
Filing Date:
January 17, 2013
Export Citation:
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Assignee:
SIKA TECHNOLOGY AG (CH)
YOSHIKAWA SOICHI (JP)
International Classes:
H05B6/10; B29C65/04; E04D5/14; E04D15/00; H05B6/06
Foreign References:
JP2011104544A2011-06-02
US6640511B12003-11-04
JP2009270285A2009-11-19
JPS5919018B21984-05-02
JPH1083884A1998-03-31
JP2001018128A2001-01-23
JPH10140774A1998-05-26
Other References:
See also references of EP 2806710A4
Attorney, Agent or Firm:
MURAYAMA Yasuhiko et al. (JP)
Yasuhiko Murayama (JP)
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Claims: